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| 9/5/01 THERMAL resistance analysis update page 1 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code cd 016 18543 167 317 67401 amc67401 128 166 21248 742 81.0 0 09/91 so,m 742 64.0 200 748 53.0 400 748 47.0 600 pd 016 405 140 170 474015a am7940-125 120 120 14400 414 85.0 0 02/90 so,m 424 69.0 200 427 61.0 400 pd 016 563 150 230 67401 67401n 128 166 21248 700 74.0 0 09/91 so,m 701 65.0 200 698 58.0 400 697 53.0 600 cd 020 461 127 197 67713a pal16v8z 82 101 8282 231 57.0 0 09/91 so,m 304 19.0 233 41.0 200 230 37.0 400 233 35.0 600 233 33.0 800 cd 020 480 160 277 67711c palce16v8-10 70 94 6580 300 68.0 0 10/90 so,m 304 53.0 200 305 44.0 400 306 40.0 600 306 35.0 800 cd 020 480 160 277 67714a palce16v8h-7 81 95 7695 286 66.0 0 01/92 so,m 291 20.0 286 53.0 200 288 43.0 400 288 38.0 600 cd 020 480 160 277 67353 pal16r8 dcj 105 114 11970 662 73.0 0 10/90 so,m 662 12.0 666 57.0 200 666 47.0 400 668 41.0 600 668 37.0 800 cd 020 18550 167 247 67920 pal16l8 bcj 106 118 12508 614 76.0 0 02/92 m 616 13.0 633 64.0 200 633 54.0 400 633 45.0 600 629 42.0 800 pd 020 590 150 190 7411y pal18p8bpc 104 132 13728 687 71.0 22.0 0 07/91 so,m 693 65.0 200 698 57.0 400 703 51.0 600 706 47.0 800 pd 020 590 150 190 4196b am7996 112 152 17024 836 61.0 0 07/89 so,m 836 14.0 msd advanced assembly technology advanced micro devices THERMAL characterization lab
9/5/01 THERMAL resistance analysis update page 2 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pd 020 21011 150 150 67350e pal16r8dc 105 114 11970 669 77.0 0 07/91 so,m 678 68.0 200 678 61.0 400 678 55.0 600 678 51.0 800 688 24.0 pd 020 21011 150 150 67320a pal16r8d 105 115 12075 687 73.0 0 04/90 so,m pd 020 21011 150 150 67320v pal16r8acn 106 118 12508 345 78.0 0 07/92 so,m 347 70.0 200 346 64.0 400 346 58.0 600 347 55.0 800 353 24.0 pd 020 21080 150 150 67711b palce16v8h-15pc/4 70 91 6370 195 80.0 0 07/91 so,m 196 70.0 200 196 61.0 400 196 56.0 600 196 53.0 800 204 31.0 pd 020 21080 150 150 67711c palce16v8-10 70 94 6580 271 71.0 0 10/90 so,m 273 61.0 200 274 55.0 400 275 51.0 600 274 47.0 800 447 25.0 pd 020 21080 150 150 6711a pal16v8q-15jc4 71 99 7029 258 74.0 0 03/92 so,m 260 65.0 200 261 61.0 400 261 54.0 800 263 50.0 600 260 27.0 pd 020 21080 150 150 67111d palce16v8q-15 71 99 7029 282 87.0 0 06/94 so,m 306 70.0 0 318 29.0 0 310 64.0 200 310 58.0 400 311 53.0 600 pd 020 21080 150 150 67713a palce16v8z-25pc 82 101 8282 227 65.0 0 06/92 so,m 227 58.0 200 229 51.0 400 230 47.0 600 231 44.0 800 234 20.0 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 3 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pd 020 21080 150 150 67718b 67718b 94 110 10340 250 90.0 0 06/94 so,m 253 81.0 200 260 72.0 400 262 67.0 600 266 6.0 800 292 31.0 pd 020 21080 150 150 67716b 67716b 94 110 10340 250 89.0 0 06/94 so,m 246 79.0 200 253 72.0 400 260 66.0 600 267 61.0 800 271 27.0 pd 020 21080 150 150 67350e pal16r8-7 98 117 11466 734 71.0 0 04/90 so,m pd 020 21098 150 150 67922h pal16r68 106 118 12508 645 72.0 0 04/90 so,m pd 020 21314 150 190 74364a pal16l8-5pc 91 129 11739 571 71.0 0 10/90 so,m 573 64.0 200 576 58.0 400 578 54.0 600 578 49.0 800 759 17.0 pd 020 21314 150 190 4797b am7997 120 163 19560 808 64.0 0 08/90 so,m 830 47.0 400 pl 020 21045/46 200 200 74364a pal16l8-7 91 129 11739 286 54.0 200 10/90 sm,m 289 49.0 400 290 45.0 600 pl 020 21045/46 200 200 74364a pal16l8-7 91 129 11739 588 63.0 0 10/90 sm,m pl 020 21045/46 200 200 74364a pal16l8-5jc 91 129 11739 987 63.0 0 08/92 sm,m 1012 55.0 200 1020 49.0 400 1025 46.0 600 1027 43.0 800 1058 20.0 pl 020 21045/46 200 200 4789a am79866 140 153 21420 620 111.0 0 01/91 so,m 660 77.0 200 670 56.0 400 380 47.0 600 690 43.0 800 pl 020 21045/46 200 200 4789a am79866 140 153 21420 680 58.0 0 12/90 sm,m 680 49.0 200 690 44.0 400 690 41.0 600 690 38.0 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 4 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pl 020 21049/50 150 150 67711c palce16v8-10 70 94 6580 280 64.0 0 11/90 sm,m 281 45.0 800 282 47.0 600 284 51.0 400 289 55.0 200 572 22.0 pl 020 21049/50 150 150 67111a pal16v8q-15jc/4 71 99 7029 288 64.0 0 03/92 sm,m 284 55.0 200 287 50.0 400 285 46.0 600 290 40.0 800 305 23.0 pl 020 21049/50 150 150 67714a palce16v8h-7 81 95 7695 294 61.0 0 01/92 sm,m 293 53.0 200 293 47.0 400 295 44.0 600 295 23.0 pl 020 21049/50 150 150 67713a palce16v8z 82 101.2 8298.4 231 57.0 0 08/91 sm,m 304 19.0 233 41.0 200 230 37.0 400 233 35.0 600 233 33.0 800 pl 020 21049 150 150 67718b 67718b 94 110 10340 250 81.0 0 06/94 sm,m 263 67.0 200 262 60.0 400 266 54.0 600 266 51.0 800 218 24.0 pl 020 21049 150 150 67716b 67716b 94 110 10340 248 82.0 0 06/94 sm,m 249 68.0 200 254 60.0 400 259 54.0 600 260 50.0 800 267 24.0 pl 020 21049/50 150 150 74165 pal16r8-7jc 98 117 11466 781 21.0 09/92 sm,m pl 020 21049/50 150 150 4788a am7966 110 120 13200 400 51.0 0 12/90 sm,m 400 45.0 200 400 41.0 400 410 38.0 600 410 37.0 800 pl 020 21049/50 150 150 4788a am7966 110 120 13200 378 96.0 0 01/91 so,m 385 70.0 200 390 52.0 400 390 45.0 600 394 40.0 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 5 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pl 020 21755 140 160 74164 pal16r8-7jc 98 117 11466 766 21.0 11/91 sm pl 020 24452 160 160 67715a palce16v8h-5jc/5 89 115 10235 548 64.0 0 05/93 sm,m 558 53.0 200 528 48.0 400 559 45.0 600 559 42.0 800 556 22.0 so 020 67711 palce16v8h-10sc/4 70 90 6300 560 91.0 0 07/92 sm,m 578 82.0 200 583 72.0 400 574 65.0 600 578 61.0 800 781 26.0 so 020 21755 140 160 67714b palce16v8h-7 81 85 6885 606 109.8 0 10/94 sm 601 102.2 200 603 90.7 400 606 79.5 600 606 72.7 800 612 23.0 so 020 21755 140 160 67711l palce16v8h 81 95 7695 607 110.5 0 10/94 sm 598 102.6 200 602 90.8 400 610 79.3 600 612 73.8 800 609 26.0 so 020 24491 140 160 6715a palce16v8h-5 85 115 9775 653 87.0 0 08/93 sm,m 643 77.0 200 636 68.0 400 648 62.0 600 651 57.0 800 08/93 sm,m 670 20.0 so 020 33742 67711l palce16v8h-10 64 82 5248 602 140.3 23.0 0 09/94 sm 597 124.5 200 601 113.2 400 606 104.2 600 608 98.2 800 so 020 33742 67714b palce16v8h-7 81 95 7695 603 169.5 0 09/94 sm 603 152.7 200 603 136.5 400 603 125.5 600 603 116.3 800 603 20.1 cd3 024 483 157 247 5533d am29c833a-bla 117 124 14508 210 97.0 0 05/90 so,m cd3 024 483 157 247 5533d am29c833a 117 124 14508 102 67.0 0 10/90 so,m msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 6 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code cd3 024 483 157 247 4167b am29827a 100 148 14800 272 61.0 0 06/87 so 272 12.0 501 59.0 501 11.0 cd3 024 483 157 247 4193c am7992b 112 134 15008 600 64.0 0 06/89 so,m 600 46.0 400 cd3 024 483 157 247 67882 pal20x8acjs 116 161 18676 584 66.0 03/92 so,m 589 56.0 200 589 48.0 400 590 41.0 600 590 38.0 800 563 13.0 cd3 024 483 157 247 67670 pal20ra10cjs 136 138 18768 615 65.0 03/92 so,m 618 56.0 200 626 45.0 400 627 39.0 600 630 36.0 800 613 8.0 cd3 024 858 168 297 67741a palce67741a 109 164 17876 471 56.0 10/93 so,m 468 46.0 200 466 40.0 400 465 32.0 600 462 30.0 800 cd3 024 858 168 297 67916a pal10h20ev8-6 134 145 19430 1413 55.0 0 01/90 so,m 1413 9.0 1413 46.0 250 1413 39.0 500 1416 35.0 750 1415 32.0 900 1412 31.0 1000 pd3 024 645 114 150 4173 am29823a 86 90 7740 410 65.0 0 02/87 so pd3 024 23850 160 160 67724a am67724a 86 102 8772 554 69.0 0 09/92 so 541 60.0 200 543 54.0 400 543 50.0 600 545 18.0 pd3 024 23850 160 160 67721 ce20v8h-10/4 76 99 7524 563 73.0 0 04/93 so,m 555 61.0 200 542 53.0 400 546 50.0 600 546 47.0 800 327 19.0 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 7 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pd3 024 23850 160 160 67983a palce20ra10h-20pl 79 112 8848 427 70.0 0 06/93 so,m 432 61.0 200 437 53.0 400 439 49.0 600 442 47.0 800 06/93 so,m pd3 024 24404 114 150 67158f palce22v10h-15 63 131 8253 479 93.2 0 11/94 so,m 473 86.3 200 476 76.9 400 480 69.3 600 482 63.5 800 482 32.3 pd 024 591 150 250 74220 pal22v10-10 104 182 18928 792 65.0 0 08/90 so,m 800 53.0 200 807 39.0 800 975 63.0 0 727 64.0 0 280 67.0 0 pd 024 21020 160 200 57158b palce22v10-4 76 156 11856 236 72.0 0 05/91 so,m 237 67.0 100 238 60.0 300 239 53.0 600 pd 024 21020 160 200 7998 am7998 126 135 17010 468 67.0 0 08/90 so,m pd 024 21020 160 200 7998 am79c98pc 126 135 17010 468 67.0 0 08/90 so,m pd 024 21020 160 200 74120c pal22v10-15pc 101 163 16463 790 67.0 0 05/91 so,m 792 61.0 200 796 56.0 400 799 51.0 600 834 17.0 pd 024 21020 160 200 67770b palce610h-15pc 98 180 17640 193 72.0 0 05/92 so,m 194 64.0 200 194 60.0 400 196 55.0 600 197 49.0 800 197 21.0 pd 024 21022 160 160 67712a palce16v8hd-15pc 75 132 9900 667 70.0 0 04/92 so,m 671 65.0 200 674 60.0 400 677 56.0 600 682 53.0 800 220 22.0 pd 024 21022 160 160 74264a am74264 100 114 11400 700 65.0 0 08/89 so,m msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 8 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pd 024 21022 160 160 74265 pal20r8-7pc 100 114 11400 849 75.0 0 02/92 so,m 852 70.0 200 857 64.0 400 860 59.0 600 864 56.0 800 899 24.0 pd 024 21022 160 160 74465a pal20r8-5 104 132 13728 831 72.0 0 03/92 so,m 836 67.0 200 840 61.0 400 844 55.0 600 845 52.0 800 864 21.0 pd 024 21022 160 160 5533d am29c833apc 117 124 14508 362 56.0 08/90 so,m pd 024 21022 160 160 4193c am7992bpc 112 134 15008 683 69.0 0 04/92 so,m 684 64.0 200 687 58.0 400 691 54.0 600 693 50.0 800 706 21.0 pd 024 21022 160 160 7921a 79c98 126 135 17010 290 71.0 0 03/91 so,m 290 19.0 290 61.0 200 293 56.0 400 293 52.0 600 pd 024 23718 160 250 67126 palce29m16h 25pc/4 118 202 23836 285 63.0 0 10/90 so,m 248 60.0 200 250 52.0 400 255 43.0 600 255 39.0 800 pd 024 23850 160 160 67841a pal20r4-10jc 113 114 12882 711 74.0 0 05/92 so,m 711 69.0 200 713 63.0 400 715 58.0 600 716 54.0 800 721 23.0 pd 024 23851 160 200 67167a palce22v10h-10pc/5 94 161 15134 404 73.0 0 04/92 so,m 418 66.0 200 418 61.0 400 420 55.0 600 419 52.0 800 424 20.0 pd 024 23852 160 250 74220 pal22v10-10pc 100 114 11400 785 66.0 0 02/92 so,m 776 59.0 200 778 53.0 400 781 47.0 600 783 43.0 800 789 14.0 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 9 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pd 024 24398 140 200 67741a palce67741a 164 109 17876 151 71.0 0 09/93 so,m 142 64.0 200 143 58.0 400 143 52.0 600 143 48.0 800 156 17.0 pd 024 24404 114 150 67269a pallv22v10-10 60 112 6720 194 86.0 0 06/94 so,m 189 72.0 200 190 65.0 400 190 60.0 600 190 55.0 800 190 26.0 pd 024 25151 140 200 67984b cezora10h-7 96 128 12288 281 73.0 0 05/94 sm,m 279 68.0 200 281 61.0 400 281 56.0 600 281 53.0 800 281 26.0 so 024 21100 150 150 5533d am29c833asc 117 124 14508 70 97.0 0 05/90 sm,m 121 86.0 0 so 024 23375 180 220 67167b palce22v10h-10 92 161 14812 534 86.0 0 10/93 sm,m 542 79.0 200 549 71.0 400 551 63.0 600 553 58.0 800 cd 028 860 321 277 97567a am27c256 103 141 14523 154 48.0 0 02/92 so,m 193 12.0 253 45.0 0 cd 028 860 321 277 97567a am27c256 103 141 14523 195 56.0 0 02/92 so,m 146 25.0 cd 028 860 321 277 97286a am27c128-125dc 123 129 15867 400 36.0 400 01/90 so,m 435 41.0 200 455 6.0 459 48.0 0 cd 028 860 321 277 97566g am27c256-170dc 123 171 21033 545 46.0 0 01/90 so,m 562 37.0 200 568 32.0 400 600 6.0 cd 028 860 321 277 97124d am27c512-255dc 156 224 34944 485 46.0 0 01/90 so,m 490 36.0 200 496 31.0 400 513 4.0 cd 028 861 321 396 99323a am99323a 193 244 47092 710 45.0 0 06/92 so,m msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 10 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code cd 028 898 227 406 9910bm am99c10a 178 305 54290 209 72.0 0 09/90 so,m 230 63.0 200 230 56.0 400 231 51.0 600 211 5.0 cd 028 15358 178 446 4544 am29cpl-s4h 146 359 52414 337 47.0 0 05/91 so,m 362 4.0 pd 028 580 310 220 97124ex am27x512pc 156 224 34944 69 61.0 0 08/90 so,m 112 54.0 0 08/90 so,m pd 028 15153 240 250 97566gx am27x256pc 123 171 21033 88 58.0 0 08/90 so,m 144 56.0 0 08/90 so,m pd 028 15153 240 250 7566r am27c256-200pc 123 171 21033 471 87.0 0 01/90 so,m 506 72.0 400 506 79.0 200 pd 028 15421 240 180 97281ax am27x128pc 123 129 15867 66 61.0 0 08/90 so,m 104 58.0 0 443 51.0 200 448 46.0 400 466 56.0 pd 028 18457 205 400 9910c am99c10a 178 305 54290 224 94.0 0 10/93 so,m 224 81.0 200 229 68.0 400 pl 028 9013 260 260 1023 am7957jc 201 203 40803 1060 45.0 0 04/88 sm,m pl 028 18457 205 400 9910bm am9910a-10a 178 305 54290 205 103.0 0 09/90 so,m 213 91.0 200 216 84.0 400 217 76.0 600 pl 028 21026 160 200 67531 palce26v12h-15pc/4 167.7 94.5 15847.65 311 65.0 0 02/92 so,m 312 59.0 200 314 54.0 400 317 50.0 600 318 48.0 800 326 19.0 pl 028 21027 160 250 67530b palce26v12 97 201.18 19514.46 261 62.0 0 05/91 so,m 265 56.0 200 268 52.0 400 268 48.0 600 269 45.0 800 pl 028 21045/46 200 200 4789a am79866 140 153 21420 680 58.0 0 12/90 sm,m 680 49.0 200 690 44.0 400 690 41.0 600 690 38.0 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 11 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pl 028 21061/62 200 200 67721 ce20v8h-10/4 76 99 7524 581 55.0 0 04/93 sm,m 606 45.0 200 613 41.0 400 603 38.0 600 595 35.0 800 336 19.0 pl 028 21061/62 200 200 67724a am67724a 86 102 8772 574 51.0 0 09/92 sm,m 573 42.0 200 574 37.0 400 576 36.0 600 579 16.0 pl 028 21061/62 200 200 67983a palce20ra10h-20jc 79 112 8848 306 56.0 0 06/93 sm,m 314 46.0 200 317 39.0 400 319 36.0 600 319 33.0 800 pl 028 21061/62 200 200 67712a palce16v8hd-15jc 75 132 9900 502 55.0 0 04/92 sm,m 470 47.0 200 473 42.0 400 475 38.0 600 478 36.0 800 463 17.0 pl 028 21061/62. 200 200 74265 pal20r8-7jc 97 111 10767 848 56.0 0 02/92 sm,m 847 50.0 200 851 46.0 400 853 42.0 600 856 39.0 800 869 19.0 pl 028 21061/62. 200 200 74264b pal20l8-7jc 97 111 10767 935 54.0 0 04/92 sm,m 923 49.0 200 925 44.0 400 930 40.0 600 936 38.0 800 971 19.0 pl 028 21061/62. 200 200 74365a pal6r8-4 91 129 11739 904 15.3 0 01/91 sm,m pl 028 21061/62 200 200 74364a pal16l8-5 91 129 11739 584 54.0 0 10/90 sm,m 585 48.0 200 586 44.0 400 589 42.0 600 589 39.0 800 pl 028 21061/62 200 200 57158b palce22v10-4 76 156 11856 289 54.0 0 05/91 sm,m 290 49.0 100 293 43.0 300 298 37.0 600 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 12 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pl 028 21061/62 200 200 67725a am67725a 96 126 12096 596 51.0 0 09/92 sm,m 599 42.0 200 600 38.0 400 602 35.0 600 606 15.0 pl 028 21061/62 200 200 67841 pal20r4-10jc 113 114 12882 705 52.0 0 05/92 sm,m 713 45.0 200 715 40.0 400 717 37.0 600 716 34.0 800 656 16.0 pl 028 21061/62 200 200 74465a pal20r8-5jc 104 132 13728 988 54.0 0 03/92 sm,m 873 49.0 200 877 43.0 400 880 40.0 600 882 37.0 800 886 18.0 pl 028 21061/62 200 200 5533d am29c833a 117 124 14508 122 56.0 0 10/90 sm,m pl 028 21061/62 200 200 6717a am6717a 94 161 15134 411 55.0 0 04/92 sm,m 405 48.0 200 406 43.0 400 408 40.0 600 408 37.0 800 pl 028 21061/62 200 200 6717a am6717a 94 161 15134 407 18.0 04/92 sm,m pl 028 21061/62 200 200 67531 palce26v12h-15jc/4 167.7 94.5 15847.65 340 55.0 0 02/92 sm,m 328 48.2 200 334 43.5 400 344 29.3 600 344 36.5 800 351 18.0 pl 028 21061/62 200 200 74120c pal22v10-15jc 101 163 16463 789 56.0 0 05/91 sm,m 795 48.0 200 800 43.0 400 802 40.0 600 824 17.0 pl 028 21061/62 200 200 7924a am79c100a1 125 135 16875 418 52.0 0 09/91 sm,m 441 45.0 200 449 41.0 400 441 39.0 600 474 53.0 pl 028 21061/62 200 200 7921a am79c98jc 126 135 17010 317 68.0 0 04/91 sm,m 317 54.0 200 321 47.0 400 321 41.0 600 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 13 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pl 028 21061/62 200 200 7921a am79c98jc 126 135 17010 319 70.0 0 04/91 so,m 322 56.0 200 323 48.0 400 323 41.0 600 pl 028 26061/62 200 200 67770b palce610h-15pc 96 180 17280 249 57.0 0 05/92 sm,m 257 47.0 200 262 44.0 400 261 39.0 600 259 36.0 800 258 20.0 pl 028 21061/62 200 200 6760a am79168 133 140 18620 951 49.0 0 11/91 sm,m 951 43.0 200 950 38.0 400 950 34.0 600 pl 028 21061/62 200 200 57950a am67950a 109 179 19511 745 52.0 0 01/92 sm,m 811 46.0 200 771 41.0 400 772 37.0 600 pl 028 21061/62 200 200 4797b am7997 120 163 19560 795 52.0 0 08/90 sm,m pl 028 21061/62 200 200 4797b am7997 120 163 19560 809 41.0 0 08/90 sm,m pl 028 21063\64 230 230 74220 p 22v10-10jc 100 114 11400 843 69.0 0 10/92 so,m 842 59.0 200 844 49.0 400 846 45.0 600 846 41.0 800 pl 028 21063/64 230 230 74220 pal22v10-10 104 182 18928 783 53.0 0 08/90 sm,m 783 46.0 200 787 38.0 800 pl 028 21063/64 230 230 67530b-c palce26v12 96.85 201.18 19484.283 261 52.0 0 05/91 sm,m 259 44.0 200 259 39.0 400 258 36.0 600 258 33.0 800 pl 028 21063/64 230 230 74220 pal22v10-10 110 179 19690 813 16.0 02/92 sm,m 809 51.0 0 790 46.0 200 822 40.0 400 796 37.0 600 795 34.0 800 pl 028 21063/64 230 230 67126 pal29m16 118 202 23836 584 51.0 0 10/91 sm,m 282 43.0 200 294 38.0 400 304 34.0 600 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 14 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pl 028 21063/64 230 230 7435 30s16 153 207 31671 990 50.0 0 10/90 sm,m 998 43.0 200 1000 39.0 400 pl 028 21063/64 230 230 79987a am79c987 175 183 32025 195 85.8 0 11/92 so,m pl 028 21063/64 230 230 79987a am79c987 175 183 32025 194 51.9 0 11/92 sm,m 142 46.0 200 141 44.0 400 141 35.0 600 91 18.5 pl 028 21063/64 230 230 79987a am79c987 175 183 32025 191 67.0 0 03/93 so,m 185 51.0 200 188 43.0 400 186 34.0 600 pl 028 21063/64 230 230 6765b 79169 188 194 36472 1435 48.0 0 07/92 sm,m 1435 43.0 200 1442 38.0 400 1442 36.0 600 1442 33.0 800 pl 028 21063/64 230 230 4769b am7969-125jc 187 196 36652 1300 52.0 0 07/89 sm,m 1300 12.0 pl 028 21077 220 314 am7905ajc 199 253 50347 243 58.0 0 04/89 sm,m pl 028 23420 175 250 7435 am30s16 153 207 31671 974 60.0 200 10/90 so,m 982 52.0 400 979 97.0 0 pl 028 23428 206 206 6760a am79168 133 140 18620 837 40.0 0 11/91 sm,m 837 34.0 200 833 30.0 400 835 26.0 600 pl 028 24399 200 200 67269a pallv22v10-10 60 112 6720 187 69.0 0 06/94 so,m 187 58.0 200 187 52.0 400 187 47.0 600 187 45.0 800 186 20.0 pl 028 24399 200 200 67269b 67269b 83 130 10790 272 66.0 0 02/94 sm,m 272 56.0 200 272 50.0 400 pl 028 24399 200 200 67269b 67269b 83 130 10790 272 45.0 600 02/94 sm,m 272 44.0 800 276 19.0 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 15 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pl 028 24393 150 150 67725a palce20v8h-5/5 96 117 11232 532 56.0 0 12/92 sm,m 529 46.0 200 531 41.0 400 531 37.0 600 527 19.0 pl 028 24399 200 200 67984b cezora10h-7 96 128 12288 280 64.0 0 05/94 so,m 280 54.0 200 280 48.0 400 281 43.0 600 281 40.0 800 281 19.0 pl 028 24399 200 200 67168a palce22v10h-7/5 93 168 15624 410 50.0 0 06/93 sm,m 409 41.0 200 410 35.0 400 409 33.0 600 412 15.0 pl 028 24399 200 200 67741a palce67741a 109 164 17876 152 59.0 0 09/93 sm,m 390 48.0 200 479 43.0 400 426 39.0 600 430 36.0 800 441 15.0 pl 028 24399 200 200 67368a ?? 105 176 18480 452 52.0 0 08/93 sm,m 454 44.0 200 457 40.0 400 459 36.0 600 459 34.0 800 plh 028 23428 206 206 6760b am79168 129 153 19737 925 42.0 0 07/92 sm,m 922 36.0 200 920 32.0 400 921 28.0 600 919 27.0 800 plh 028 24426 240 240 6765b 79165-275 188 194 36472 1292 56.0 0 03/92 so,m 1305 46.0 200 1317 33.0 400 plh 028 24426 240 240 6765b 79165-275 188 194 36472 1297 39.0 0 03/92 sm,m 1310 36.0 200 1306 31.0 400 1298 27.0 600 1308 26.0 600 03/92 so,m so 028 21421 5576ay am29c676sc 79 138 10902 127 55.0 0 04/91 sm,m 145 50.0 200 145 44.0 400 145 42.0 600 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 16 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code cl 032 21280 285 315 97286a am27c64-255lc 123 129 15867 448 55.0 0 01/90 sm,m 457 47.0 200 457 44.0 400 483 11.0 cl 032 21280 285 315 97566f am27c256-155lc 123 171 21033 463 52.0 0 01/90 sm,m 471 45.0 200 472 41.0 400 492 9.0 cl 032 21280 285 315 97124 am27c512-300lc 156 244 38064 439 47.0 0 01/90 sm,m 548 40.0 200 552 37.0 400 577 5.0 cl 032 21280 285 315 97101b am27c010-200lc 228 264 60192 564 49.0 0 01/90 sm,m 592 44.0 200 598 39.0 400 623 5.0 pd 032 21683 300 300 97102a am27c010 181 208 37648 67 42.0 0 10/90 so,m pd 032 21683 300 300 97102a am27c010 181 208 37648 121 43.0 0 10/90 so,m pd 032 21683 300 300 97101cx am27x010pc 228 264 60192 83 61.0 0 08/90 so,m pd 032 21683 300 300 97101cx am27x010pc 228 264 60192 135 51.0 0 08/90 so,m pd 032 23400 350 250 97201br am27c020 250 350 87500 73 50.0 0 02/91 so,m cd 032 15050 351 386 97102a am27c010 181 208 37648 67 37.0 0 10/90 so,m 109 39.0 0 cd 032 15050 351 386 9101an am27c010-200dc 228 264 60192 596 35.0 0 01/90 so,m 600 29.0 200 600 25.0 400 635 3.0 cd 032 15050 351 386 97402b am27040 266 272 72352 87 44.0 0 05/92 so,m pl 032 15584 230 250 paetc amd THERMAL test die 208 212 44096 992 49.7 11.8 0 03/96 1s0p 1019 37.1 200 1022 33.6 400 1029 31.6 600 1032 30.1 800 pl 032 15584 230 250 paetc amd THERMAL test die 208 212 44096 1013 35.3 11.4 0 03/96 2s2p 1026 29.5 200 1031 28.0 400 1034 27.0 600 1034 26.3 800 pl 032 18514 246 194 97286a am27c128-305jc 123 129 15867 436 64.0 0 01/90 sm,m 446 55.0 200 446 51.0 400 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 17 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pl 032 18514 246 194 97566gx am27x256jc 123 171 21033 88 59.0 0 09/90 sm,m 143 58.0 0 pl 032 18514 246 194 97566r am27c256-205jc 123 171 21033 381 59.0 0 01/90 sm,m 461 50.0 200 462 47.0 400 pl 032 18514 246 194 97124ex am27x512 156 224 34944 76 63.0 0 09/90 sm,m pl 032 18514 246 194 97124ex am27x512 156 224 34944 124 58.0 0 09/90 sm,m pl 032 18514 246 194 97124ex am27x512 156 224 34944 201 78.0 0 09/90 sm,m pl 032 18514 246 194 97124ex am27x512 156 224 34944 205 69.0 200 09/90 sm,m pl 032 21468 270 290 97101cx am27x010 228 264 60192 75 61.0 0 09/90 sm,m 120 59.0 0 09/90 sm,m pl 032 21630 240 330 9910bm am99c10a 178 305 54290 205 66.0 400 09/90 sm,m 206 62.0 600 pl 032 23993 296 302 paetc amd THERMAL test die 208 212 44096 801 32.3 9.3 0 06/97 2s2p 97118 1831 31.5 9.3 0 3146 30.8 9.5 0 3219 27.2 200 3254 25.6 400 3285 24.3 600 3312 23.1 800 pl 032 23993 296 302 paetc amd THERMAL test die 208 212 44096 624 46.7 10.7 0 08/97 1s0p 97119 1384 44.7 11.4 0 2410 43.0 11.7 0 2495 35.9 200 2544 32.4 400 2588 29.2 600 2623 26.9 800 pl 032 24148 200 180 97282ar am 27c128 103 111 11433 168 75.0 0 06/94 sm,m pl 032 24493 310 340 29f040 am29f040 262 297 77814 115 50.0 0 10/93 sm,m 118 45.0 200 117 39.0 400 117 38.0 600 117 35.0 800 ts 032 24026 275 235 97566gr am27c256 123 171 21033 156 80.0 0 05/91 sm,m 163 76.0 200 155 71.0 400 156 65.0 600 154 61.0 800 ts 032 24026 275 235 98104at am28f010 235 275 64625 162 113.0 0 06/94 sm,m 160 15.0 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 18 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code ts 032 24341e 272 236 98104at 28f010 187 252 47124 83 94.0 0 01/93 sm,m 83 84.0 200 83 75.0 400 85 70.0 600 84 65.0 800 tsr 032 24478e 338 279 29f040 am29f040 262 297 77814 122 95.0 0 10/93 sm,m 123 83.0 200 123 75.0 400 123 70.0 600 123 66.0 800 cd 040 467 267 287 8151a am8151a 168 180 30240 1143 33.0 0 4/90 so,m 1193 6.0 cd 040 855 336 406 97244d am27c1024-95dc 251 253 63503 542 32.0 0 01/90 so,m 600 27.0 200 600 24.0 400 605 4.0 pd 040 574 300 300 9428bs am79c302pc 192 264 50688 56 45.0 0 12/90 so,m pd 040 574 300 300 9568 am9568 224 250 56000 1270 13.0 12/90 so,m pd 040 985 300 300 97244ex am27x1024 251 253 63503 113 50.0 0 09/90 so,m 186 45.0 0 pd 040 21038 350 350 5987bs am80c287 250 300 75000 105 38.0 0 10/90 sm,m 111 29.0 400 ts 040 25288 433 236 paetc 2 x 3 212 314 66568 490 81.7 15.0 0 04/96 1s0p 994 78.7 12.9 0 503 65.7 200 495 58.4 400 499 54.6 600 499 51.9 800 ts 040 25288 433 236 paetc 2 x 3 212 314 66568 500 49.9 9.3 0 04/96 2s2p 1007 48.8 7.4 0 494 45.3 200 495 43.0 400 496 41.5 600 496 39.8 800 ts 040 x25680 157 157 paetc amd THERMAL test die 212 208 44096 746 91.1 12.5 0 04/99 1s0p s98027 766 74.7 200 787 65.9 400 786 61.0 600 808 53.9 800 ts 040 x25680 157 157 paetc amd THERMAL test die 212 208 44096 1306 52.1 8.0 0 04/99 2s2p s98028 1338 46.6 200 1359 41.7 400 1365 39.0 600 1364 36.0 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 19 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code ts 040 25680 157 157 paetc amd THERMAL test die 212 314 66568 1637 41.3 7.5 0 04/99 2s2p s98034 1646 37.4 200 1662 35.0 400 1676 33.8 600 1676 32.6 800 ts 040 x25807 118 118 paetc amd THERMAL test die 212 208 44096 713 96.6 16.0 0 03/99 1s0p s98029 734 79.1 200 756 69.8 400 760 64.7 600 769 60.5 800 ts 040 x25807 118 118 paetc amd THERMAL test die 212 208 44096 1212 56.9 11.0 0 03/99 2s2p s98030 1211 52.4 200 1211 49.2 400 1210 46.3 600 1210 44.3 800 ts 040 x25808 118 118 paetc amd THERMAL test die 208 212 44096 898 76.8 14.1 0 03/99 1s0p s98031 915 63.7 200 924 58.4 400 942 53.8 600 942 51.8 800 ts 040 x25808 118 118 paetc amd THERMAL test die 208 212 44096 1394 48.6 8.5 0 03/99 2s2p s98032 1418 42.9 200 1419 40.9 400 1449 38.0 600 1449 37.4 800 ts 040 25288 433 236 paetc amd THERMAL test die 314 102 32028 878 76.1 17.8 0 02/00 1s0p s98035 907 60.8 200 923 53.4 400 941 48.8 600 941 43.6 800 ts 040 25288 433 236 paetc amd THERMAL test die 314 102 32028 1637 41.4 7.5 0 02/00 2s2p s98036 1646 36.3 200 1662 33.7 400 1676 32.4 600 1676 31.8 800 ts 040 25288 433 236 paetc amd THERMAL test die 420 212 89040 833 79.6 26.4 0 06/00 1s0p s98037 868 65.3 200 885 55.7 400 884 51.3 600 902 46.9 800 ts 040 25288 433 236 paetc amd THERMAL test die 420 212 89040 1508 45.0 12.3 0 06/00 2s2p s98038 1554 40.1 200 1553 37.4 400 1552 36.0 600 1577 34.1 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 20 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code ts 040 x25730 157 157 paetc amd THERMAL test die 212 208 44096 1161 57.7 12.7 0 03/00 2s2p s98040 1159 51.7 200 1187 48.0 400 1186 46.7 600 1183 43.8 800 ts 040 x25730 157 157 paetc amd THERMAL test die 212 314 66568 930 70.8 15.6 0 02/00 1s0p s98041 969 57.7 200 991 50.4 400 990 46.8 600 990 46.9 800 ts 040 x25730 157 157 paetc amd THERMAL test die 212 314 66568 1237 53.2 11.4 0 02/00 2s2p s98042 1269 46.6 200 1283 42.6 400 1306 40.1 600 1306 36.1 800 ts 040 x25730 157 157 paetc amd THERMAL test die 322 208 66976 890 74.3 14.6 0 03/00 2s2p s98025 916 61.4 200 925 54.5 400 923 51.0 600 936 48.1 800 ts 040 x25807 118 118 paetc amd THERMAL test die 322 208 66976 1240 53.3 12.5 0 03/00 2s2p s98026 1260 47.3 200 1282 43.6 400 1281 41.6 600 1295 40.4 800 pl 044 9009 350 350 9430d am79c30ajc/d 256 303 77568 162 52.0 0 09/90 sm,m 162 47.0 100 162 42.0 400 162 37.0 700 162 34.0 1000 pl 044 9009 350 350 5987bs am80c287 250 330 82500 91 40.0 0 10/90 sm,m pl 044 9017 230 230 68110 mach 110-15jc 129 127 16383 432 39.0 0 02/91 sm,m 436 33.0 200 437 30.0 400 439 27.0 600 440 25.0 800 pl 044 9017 230 230 68112a mach 111-5/7 115 184 21160 472 24.4 0 11/95 sm,6 530 17.5 200 530 16.7 400 530 15.5 600 530 14.7 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 21 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pl 044 9017 230 230 68211a 68214a 146 162 23652 651 30.4 0 06/95 1s0p 699 18.5 200 691 15.9 400 686 13.5 600 678 12.8 800 678 12.2 1000 752 4.0 pl 044 9017 230 230 68110 mach 110 196 125 24500 514 40.0 0 10/91 sm,m 508 12.0 508 35.0 200 531 32.0 400 528 29.0 600 525 26.0 800 pl 044 9017 230 230 68110 mach110-15 129 197 25413 428 42.0 0 09/91 sm,m 431 36.0 200 432 14.0 432 32.0 400 433 30.0 600 434 28.0 800 pl 044 9017 230 230 68210a mach 110-15jc 172 205 35260 618 69.0 0 06/94 so,m pl 044 9017 230 230 68110 mach 210-15jc 197 213 41961 391 40.0 0 02/91 sm,m 403 36.0 200 409 33.0 400 409 31.0 600 389 29.0 800 pl 044 9017 230 230 68210 mach210-15jc 197 213 41961 501 15.0 09/91 sm,m 493 15.0 497 37.0 200 497 33.0 400 501 31.0 600 483 31.0 800 pl 044 17605 200 200 66110 masc 110 147 116 17052 387 43.0 0 10/91 sm,m 361 22.0 369 40.0 200 386 36.0 400 377 35.0 600 379 34.0 800 pl 044 17605 200 200 66210a masc 210 122 164 20008 637 49.0 0 01/92 sm,m 641 18.0 pl 044 17605 200 200 66210 masc 210 122 164 20008 598 43.0 01/92 sm,m 617 14.0 pl 044 17605 200 200 4787z am7985ajc 153 153 23409 889 60.0 0 08/90 so,m 898 51.0 200 908 41.0 400 915 39.0 600 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 22 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pl 044 19001 300 300 paetc amd THERMAL test die 208 212 44096 2044 30.2 12.1 0 03/98 2s2p 97151 2060 26.2 200 2073 25.0 400 2092 23.4 600 2091 22.3 800 pl 044 21743 270 270 paetc 2 x 2 208 212 44096 1010 44.6 12.9 0 03/96 1s0p 1030 33.1 200 1035 30.0 400 1041 28.1 600 1049 27.0 800 pl 044 21743 270 270 paetc 2 x 2 208 212 44096 1351 31.4 10.9 0 03/96 2s2p 1324 26.5 200 1336 25.0 400 1334 24.2 600 1340 23.6 800 cl 044 14626 445 445 9244d am27c1024-250le 251 253 63503 598 34.0 0 02/90 sm,m 606 31.0 200 610 28.0 400 636 3.0 cft 044 23961 294 294 68110a mach110-20es 120 195 23400 543 6.0 09/91 sm,m 846 43.0 0 888 36.0 200 906 33.0 400 906 31.0 600 912 29.0 800 cft 044 23961 294 294 68210a mach210-20es ?? ?? 34850 685 5.0 09/91 sm,m 891 40.0 0 882 35.0 200 893 33.0 400 917 30.0 600 935 28.0 800 pqt 044 25365 236 236 68112a mach 111-5 115 184 21160 378 37.3 0 01/96 2s2p 382 32.6 200 380 30.8 400 382 29.1 600 382 29.1 800 pqt 044 25365 236 236 68111a mach 111(bp pattern) 131 216 28296 473 40.7 0 06/95 2s2p 498 34.2 200 498 33.4 400 498 31.8 600 504 30.6 800 pqt 044 25365 236 236 68111a mach 111(be pattern) 131 216 28296 476 39.6 0 06/95 2s2p 475 34.7 200 479 32.9 400 478 32.5 600 478 31.3 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 23 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pqt 044 25365 236 236 68211a mach210a 236 236 55696 783 41.0 0 06/95 2s2p 784 35.0 200 786 33.7 400 786 32.6 600 785 32.0 800 800 11.3 pqt 044 25365 236 236 paetc amd THERMAL test die 102 212 21624 1033 55.7 7.4 0 02/00 1s0p 99060 1062 47.1 200 1075 42.7 400 1083 40.1 600 1086 38.4 800 pqt 044 25365 236 236 paetc amd THERMAL test die 102 212 21624 1070 38.4 5.5 0 02/00 2s2p 99061 1087 35.0 200 1094 33.1 400 1097 31.8 600 1099 31.1 800 so 044 25185 300 390 98962a am29f400 266 312 82992 186 88.0 0 07/94 1s0p bcc 048 e001 197 197 paetc amd THERMAL test die 102 102 10404 0.418 160.6 18.1 0 04/01 1s2p 21066 0.427 139.2 200 0.431 129.1 400 0.434 122.5 600 0.436 118.7 800 bcc+ 048 e001 197 197 paetc amd THERMAL test die 102 102 10404 0.495 137.5 16.6 0 04/01 1s2p 21067 0.506 119.2 200 0.512 110.6 400 0.516 104.5 600 0.517 101.5 800 fba 048 26661 281 200 paetc amd THERMAL test die 208 102 21216 770 95.8 14.1 0 05/00 1s0p 99030 790 81.6 200 806 71.0 400 815 65.8 600 821 62.3 800 fba 048 26661 281 200 paetc amd THERMAL test die 208 102 21216 1417 49.2 6.1 0 05/00 2s2p 99031 1437 45.5 200 1445 43.6 400 1453 42.2 600 1456 41.4 800 fbb 048 26086 330 212 paetc amd THERMAL test die 208 102 21216 697 89.0 10.5 0 05/00 1s0p 99028 716 74.0 200 728 65.2 400 735 59.8 600 739 56.9 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 24 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code fbb 048 26086 330 212 paetc amd THERMAL test die 208 102 21216 1439 46.0 4.4 0 05/00 2s2p 99029 1461 42.0 200 1469 40.3 400 1476 39.0 600 1480 38.1 800 fbc 048 26084 319 315 paetc amd THERMAL test die 208 212 44096 878 78.8 5.3 0 05/00 1s0p 99026 901 65.4 200 917 56.9 400 926 51.9 600 933 48.7 800 fbc 048 26084 319 315 paetc amd THERMAL test die 208 212 44096 2010 35.7 3.9 0 05/00 2s2p 99027 2044 32.2 200 2057 30.6 400 2069 29.4 600 2077 28.5 800 fbc 048 x26085 354 315 paetc amd THERMAL test die 208 212 44096 729 89.2 0 02/99 1s0p 98052 752 74.0 200 767 63.1 400 775 56.4 600 779 53.9 800 fgb 048 25967 354 236 paetc amd THERMAL test die 102 212 21624 2412 42.5 0 02/98 2s2p 98006 fgb 048 25967 354 236 paetc amd THERMAL test die 102 212 21624 1134 91.0 0 02/98 1s0p 98005 pd 048 21365 250 250 7990 am79c90 203 204 41412 112 57.0 0 10/92 so,m pqt 048 25571 157 157 paetc amd THERMAL test die 102 102 10404 295 94.7 23.9 0 02/97 1s0p 97076 689 91.4 24.3 0 1153 89.2 24.9 0 1165 76.4 200 1186 69.4 400 1202 63.9 600 1214 60.2 800 pqt 048 25571 157 157 paetc amd THERMAL test die 102 102 10404 522 75.5 25.2 0 02/97 2s1p 97069 521 70.5 200 524 66.6 400 527 64.0 600 530 61.9 800 pqt 048 25571 157 157 paetc amd THERMAL test die 102 102 10404 541 52.6 16.6 0 02/97 2s2p 97077 1224 52.0 16.8 0 2012 51.4 17.0 0 2054 46.6 200 2074 44.4 400 2088 42.8 600 2100 41.7 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 25 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code ts 048 25504 433 220 paetc amd THERMAL test die 102 314 32028 507 83.6 16.6 0 03/96 1s0p 511 69.0 200 514 62.5 400 516 57.7 600 518 54.4 800 1038 81.0 14.5 0 ts 048 25504 433 220 paetc amd THERMAL test die 102 314 32028 507 45.5 11.9 0 03/96 2s2p 511 38.9 200 514 37.0 400 516 35.5 600 518 34.4 800 1038 44.9 9.4 0 ts 048 25534 157 157 paetc amd THERMAL test die 102 102 10404 791 86.0 14.8 0 06/00 1s0p s98011 813 70.6 200 837 61.3 400 861 54.6 600 884 48.3 800 ts 048 25534 157 157 paetc amd THERMAL test die 102 102 10404 1573 43.3 7.1 0 04/00 2s2p s98012 1599 37.6 200 1598 35.9 400 1626 33.4 600 1625 31.1 800 ts 048 25616 118 118 paetc amd THERMAL test die 102 102 10404 792 84.2 21.8 0 07/00 1s0p s98003 813 69.2 200 834 61.3 400 833 58.9 600 837 55.9 800 ts 048 25616 118 118 paetc amd THERMAL test die 102 208 21216 1495 44.8 9.0 0 04/99 2s2p s98018 1494 41.5 200 1536 38.1 400 1536 36.8 600 1536 35.0 800 ts 048 x25854 70 70 paetc amd THERMAL test die 208 102 21216 729 94.5 16.8 0 03/99 1s0p s98013 758 76.8 200 763 70.5 400 763 66.2 600 752 63.4 800 ts 048 x25854 70 70 paetc amd THERMAL test die 208 102 21216 1249 55.2 10.9 0 03/99 2s2p s98014 1288 49.4 200 1288 47.0 400 1288 45.3 600 1288 44.7 800 ts 048 x25854 70 70 paetc amd THERMAL test die 208 102 21216 1442 46.1 12.3 0 01/00 2s2p s98024 1483 40.8 200 1483 38.6 400 1482 37.6 600 1516 35.1 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 26 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code ts 048 25855 287 161 paetc amd THERMAL test die 208 102 21216 1233 82.8 22.9 0 05/98 1s0p s98001 1292 69.2 200 1337 59.7 400 1328 55.9 600 1351 52.5 800 ts 048 25855 287 161 paetc amd THERMAL test die 208 102 21216 1827 55.0 13.0 0 05/98 2s2p s98002 1861 47.8 200 1895 43.5 400 1903 41.5 600 1912 40.2 800 ts 048 25855 287 161 paetc amd THERMAL test die 322 102 32844 1061 62.5 10.4 0 04/99 1s0p s98015 1087 53.5 200 1108 48.3 400 1113 44.5 600 1113 42.7 800 ts 048 25855 287 161 paetc amd THERMAL test die 322 102 32844 1782 38.2 7.2 0 04/99 2s2p s98016 1817 34.0 200 1816 32.6 400 1837 31.2 600 1851 30.1 800 ts 048 25900 287 224 paetc amd THERMAL test die 208 212 44096 1547 44.1 7.7 0 06/00 2s2p s98022 1584 39.4 200 1583 37.3 400 1615 35.1 600 1614 34.0 800 so 056 x26239 157 157 paetc amd THERMAL test die 208 322 66976 1836 44.3 9.4 0 07/98 2s2p 98017 1873 37.9 200 1895 35.5 400 1900 34.2 600 1918 33.0 800 so 056 x26239 157 157 paetc amd THERMAL test die 208 212 44096 1364 71.7 17.9 0 07/98 1s0p 98023 1396 59.3 200 1424 53.3 400 1452 48.6 600 1452 46.3 800 so 056 x26239 157 157 paetc amd THERMAL test die 208 212 44096 1443 52.1 11.7 0 07/98 2s2p 98024 1467 45.2 200 1478 42.8 400 1484 41.2 600 1495 39.7 800 so 056 x26239 157 157 paetc amd THERMAL test die 208 322 66976 1716 62.3 14.9 0 07/98 1s0p 98025 1783 50.1 200 1810 44.8 400 1837 40.6 600 1858 37.9 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 27 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code fbd 063 26083 528 315 paetc amd THERMAL test die 420 212 89040 1042 64.5 5.2 0 05/00 1s0p 99032 1073 51.5 200 1090 44.2 400 1101 39.8 600 1109 37.1 800 fbd 063 26083 528 315 paetc amd THERMAL test die 420 212 89040 2680 26.7 4.0 0 05/00 2s2p 99033 2729 23.7 200 2751 22.2 400 2769 21.1 600 2777 20.5 800 pqt 064 x25668 236 236 paetc amd THERMAL test die 208 212 44096 1585 63.8 17.2 0 03/99 1s0p 98043 1641 54.0 200 1679 47.7 400 1710 43.2 600 1716 41.1 800 pqt 064 x25668 236 236 paetc amd THERMAL test die 208 212 44096 1637 40.9 5.2 0 02/99 2s2p 98044 1668 35.1 200 1666 32.8 400 1708 30.7 600 1708 30.0 800 pqt 064 25668 236 236 paetc amd THERMAL test die 208 212 44096 1601 64.2 12.3 0 09/99 1s0p 99051 1659 53.8 200 1692 48.1 400 1714 44.2 600 1731 41.7 800 1879 14.7 0 pqt 064 25668 236 236 paetc amd THERMAL test die 208 212 44096 1733 36.3 3.3 0 09/99 2s2p 99047 1770 32.6 200 1781 30.8 400 1789 29.6 600 1794 28.9 800 1743 8.7 0 pl 068 9001 350 350 68220 mach220-15jc 232 331 76792 1146 33.0 0 05/92 sm,m 1169 29.0 200 1177 27.0 400 1171 24.0 600 1153 23.0 800 1153 10.0 pl 068 14904 285 285 5989ar amn80c286 219 225 49275 1718 38.0 0 01/92 so,m 1831 10.0 pl 068 14904 285 285 5989ar amn80c286 219 225 49275 1323 41.0 0 01/92 sm,m 1664 11.0 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 28 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pl 068 17586 260 260 68120 mach120-15jc 200 201 40200 621 37.0 0 05/92 sm,m 672 33.0 200 667 30.0 400 673 28.0 600 673 25.0 800 673 13.0 pl 068 24162 260 260 7990 am79c90 203 204 41412 102 50.7 0 10/92 sm,m 154 16.0 pqr 080 21699 365 365 5986b am80c286 311 326 101386 500 50.0 0 07/90 sm, m 500 47.0 100 500 46.0 150 500 45.0 200 pqr 080 21699 365 365 5986b am80c286 311 326 101386 1000 48.0 0 07/90 sm,m 1000 46.0 100 1000 45.0 150 1000 43.0 200 pqr 080 21699 365 365 5986b am80c286 311 326 101386 1500 46.0 0 07/90 sm,m 1500 44.0 100 1500 43.0 200 1500 43.0 300 pqr 080 21699 365 365 5986b am80c286 311 326 101386 2000 45.0 0 07/90 sm,m 2000 43.0 100 2000 42.0 150 2000 41.0 200 pqr 080 24432 283 283 5887br 5887br 172 231 39732 399 53.0 0 10/93 sm, m 371 44.0 200 399 40.0 400 381 37.0 600 385 35.0 800 pqt 080 24475 287 287 79940a am79c940vc 199 221 43979 279 68.0 0 05/94 sm,m 280 52.0 200 281 47.0 400 280 44.0 600 274 40.0 800 276 9.0 pqt 080 26702 185 185 paetc amd THERMAL test die 102 102 10404 1067 67.4 7.9 0 07/99 1s0p 99016 1101 58.5 200 1119 53.1 400 1133 48.5 600 1138 46.7 800 pqt 080 26702 185 185 paetc amd THERMAL test die 102 102 10404 1147 40.0 5.4 0 07/99 1s0p 99017 1167 37.6 200 1176 35.8 400 1178 34.8 600 1182 34.0 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 29 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pqt 080 26728 304 304 paetc amd THERMAL test die 208 322 66976 2117 48.4 6.4 0 09/99 1s0p 99050 2217 39.7 200 2263 34.9 400 2294 31.2 600 2302 29.2 800 1815 8.2 0 pqt 080 26728 304 304 paetc amd THERMAL test die 208 322 66976 2922 26.7 2.2 0 09/99 2s2p 99049 2993 23.5 200 3022 21.9 400 3040 20.9 600 3051 20.3 800 3101 4.8 0 cft 084 24069 395 395 68130a am68130a 206 228 46968 1048 28.0 0 07/92 sm,m 1061 24.0 200 1079 20.0 400 1076 19.0 600 1105 17.0 800 1255 4.0 pl 084 15224 425 425 paetc 2 x 2 208 212 44096 1033 34.7 9.9 0 10/96 1s0p 1033 27.1 200 1039 24.6 400 1047 21.9 600 1053 20.4 800 pl 084 15224 425 425 paetc 2 x 2 208 212 44096 1033 28.3 7.8 0 10/96 2s2p 997 22.5 200 1001 21.4 400 1003 20.4 600 1006 19.5 800 1832 27.6 8.5 0 pl 084 15224 425 425 paetc 3 x 3 314 322 101108 1070 31.9 7.8 0 10/96 1s0p 1035 23.9 200 1036 21.6 400 1042 19.2 600 1048 17.3 800 pl 084 15224 425 425 paetc 3 x 3 314 322 101108 1012 25.6 6.3 0 10/96 2s2p 1015 20.0 200 1012 18.4 400 1015 16.9 600 1018 16.2 800 2142 24.9 7.0 0 pl 084 15224 425 425 79900a am79900a 383 394 150902 295 34.0 0 05/90 sm,m pl 084 15224 425 425 79900a am79900a 383 394 150902 441 39.0 0 08/90 so,m pl 084 15224 425 425 79900a am79900a 383 394 150902 1173 26.0 0 05/90 so,m msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 30 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pl 084 15380 360 360 paetc 2 x 2 208 212 44096 1040 35.4 11.2 0 10/96 1s0p 988 28.3 200 994 25.9 400 1003 22.5 600 1006 21.6 800 pl 084 15380 360 360 paetc 2 x 2 208 212 44096 1053 29.2 8.5 0 10/96 2s2p 1048 22.9 200 1052 21.7 400 1055 20.6 600 1058 18.8 800 1945 28.5 8.7 0 pl 084 15380 360 360 4786z am7984a 310 320 99200 2309 34.0 0 08/90 so,m 2378 30.0 200 2447 26.0 400 2503 23.0 600 pl 084 15380 360 360 4790a am7984 310 320 99200 2903 30.0 0 02/92 sm,m 2945 28.0 200 3018 26.0 400 3054 24.0 600 3081 23.0 800 pl 084 15380 360 360 4786a am7984a 310 320 99200 2651 29.0 0 02/90 sm,m 2706 25.0 200 2781 23.0 400 2807 21.0 600 2838 19.0 800 3230 8.0 pl084 15380 360 360 paetc 3 x 3 314 322 101108 1040 32.4 8.2 0 10/96 1s0p 967 25.2 200 972 22.8 400 1022 20.3 600 1024 19.1 800 pl 084 15380 360 360 paetc 3 x 3 314 322 101108 1020 26.3 6.9 0 10/96 2s2p 1008 20.3 200 1013 18.5 400 1014 18.1 600 1015 17.8 800 1901 25.7 7.0 0 pl 084 23743 300 300 79940a 79c940 199 221 43979 305 37.0 0 11/92 1s0p 304 27.0 400 497 12.0 pl 084 23743 300 300 paetc 2 x 2 208 212 44096 1039 37.4 11.5 0 10/96 1s0p 1007 29.9 200 1017 26.9 400 1023 24.1 600 1026 23.0 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 31 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pl 084 23743 300 300 paetc 2 x 2 208 212 44096 1019 31.3 8.9 0 10/96 2s2p 995 26.7 200 999 25.7 400 1006 23.4 600 1008 22.5 800 1903 30.1 10.4 0 pl 084 23743 300 300 68130 mach 131 206 228 46968 743 28.1 0 06/96 2s2p 729 22.2 200 pl 084 23743 300 300 79984ar am79c984jc 217 246 53382 586 41.7 0 02/96 so 774 29.4 200 711 25.7 400 713 23.7 600 731 22.3 800 pl 084 23743 300 300 79984ar am79c984jc 217 246 53382 707 33.8 0 02/96 2s2p 735 27.8 200 732 26.4 400 735 24.6 600 734 23.6 800 pl 084 23743 300 300 68131a mach 131 246 249 61254 781 30.0 8.8 0 06/96 2s2p 850 24.9 200 855 23.8 400 856 22.4 600 855 21.3 800 pl 084 23747 68130a mach 130-20jc 206 228 46968 652 32.0 0 11/91 sm,m 652 13.0 11/91 sm,m pl 084 23747 68130 mach130-15jc 206 228 46968 919 34.0 0 05/92 sm,m 918 31.0 200 923 28.0 400 941 26.0 600 959 25.0 800 pl 084 23747 68233a mach231-jc/1 185 268 49580 1049 18.8 0 11/95 2s1p 1074 15.1 200 1063 14.2 400 1064 13.4 600 1067 12.5 800 pl 084 25538 275 275 68130 mach 131 206 228 46968 725 28.3 10.0 0 06/96 2s2p 650 23.5 200 pl 084 25538 275 275 paetc amd THERMAL test die 102 102 10404 1610 42.6 15.4 0 03/00 2s2p s98085 1670 34.8 200 1732 31.3 400 1731 29.3 600 1731 28.3 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 32 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pl 084 25538 275 275 paetc amd THERMAL test die 102 102 10404 1912 35.8 15.8 0 02/00 2s2p s98086 1924 32.3 200 1937 30.5 400 1990 28.3 600 1990 27.9 800 pl 084 25538 275 275 paetc amd THERMAL test die 208 212 44096 1872 35.5 11.9 0 03/00 2s2p s98083 1985 32.5 200 1984 31.3 400 2019 28.5 600 2018 26.5 800 pl 084 25538 275 275 paetc amd THERMAL test die 208 212 44096 2142 31.4 10.7 0 02/00 2s2p s98084 2176 27.9 200 2212 25.9 400 2211 24.5 600 2247 23.5 800 plh 084 vendor paetc amd THERMAL test die 314 322 101108 2804 15.9 3.2 0 06/96 2s2p plh 084 vendor paetc amd THERMAL test die 314 322 101108 3313 15.0 3.0 0 06/96 2s2p plh 084 24046 365 365 68231 mach230-20jc 206 228 46968 943 20.0 0 07/91 sm,m 983 17.0 200 890 14.0 400 886 12.0 600 886 10.0 800 931 5.0 plh 084 24046 365 365 4790a am7984 310 320 99200 2989 19.0 0 02/92 sm,m 3018 18.0 200 3080 15.0 400 3120 14.0 600 3153 12.0 800 plh 084 24142 365 365 68230a mach68230 247 331 81757 1808 18.0 0 10/91 sm 1772 15.0 200 1700 13.0 400 1817 11.0 600 1753 10.0 800 plh 084 24389 430 430 68335a mach 435-15jc 294 400 117600 1685 20.0 0 03/93 sm, m 1743 18.0 200 1771 15.0 400 1779 14.0 600 1786 13.0 800 plh 084 25105 300 365 paetc amd THERMAL test die 208 212 44096 2878 14.6 2.9 0 06/96 2s2p plh 084 25105 300 365 paetc amd THERMAL test die 314 322 101108 3451 13.6 2.2 0 06/96 2s2p msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 33 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code plh 084 26757 425 425 paetc amd THERMAL test die 314 322 101108 3882 20.1 2.3 0 09/99 1s0p 99020 4009 15.9 200 4104 13.6 400 4169 11.7 600 4212 10.4 800 plh 084 26757 425 425 paetc amd THERMAL test die 314 322 101108 3873 16.8 2.4 0 09/99 2s2p 99021 3970 14.2 200 4016 12.6 400 4056 11.4 600 4083 10.5 800 plh 084 26758 520 520 paetc amd THERMAL test die 420 432 181440 4307 18.9 2.2 0 09/99 1s0p 99022 4193 15.1 200 4268 12.3 400 4324 10.3 600 4351 9.2 800 plh 084 26758 520 520 paetc amd THERMAL test die 420 432 181440 4340 15.0 2.7 0 09/99 2s2p 99023 4436 12.6 200 4486 11.0 400 4531 9.8 600 4553 9.0 800 cg 084 17541 385 385 1182a am81c458 255 280 71400 900 25.0 0 07/88 so,m pqb 100 23704 390 390 5982 am386(tm/sx) 255 293 74715 491 60.0 0 02/91 so,m 525 46.0 150 524 44.0 200 522 40.0 400 523 37.0 600 pqb 100 23704 390 390 46505b therm test die 327 342 111834 511 49.0 0 09/91 sm,m 503 39.0 150 501 38.0 200 499 35.0 400 494 30.0 600 pqb 100 23704 390 390 am29205 29205ar 337 345 116265 741 37.0 0 08/92 so,m 772 28.0 200 779 22.0 400 783 20.0 600 783 19.0 800 783 8.0 pqb 100 24372 370 370 5984ar am386-sx40 255 293 11433 525 49.0 0 07/94 sm,m pql 100 25122 315 315 18602an am186x2-40 207 232 48024 1199 57.0 0 08/94 sm,m 1096 54.0 200 1104 50.0 400 1119 48.0 600 1109 47.0 800 1098 7.0 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 34 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pql 100 25122 315 315 4653 5883 220 225 49500 708 48.0 0 12/93 sm,m s98062 712 38.0 200 710 33.0 400 714 30.0 600 712 25.0 800 703 7.0 0 pql 100 25163 256 256 paetc amd THERMAL test die 102 102 10404 2472 41.6 11.9 0 07/98 2s2p 2551 36.9 200 2549 35.6 400 2548 34.1 600 2548 32.5 800 pql 100 25163 256 256 8580f am85c80 169 218 36842 350 57.0 11.0 0 01/94 sm,m 350 46.0 200 348 41.0 400 348 38.0 600 352 37.0 800 pql 100 25163 256 256 8580f am85c80 169 218 36842 580 55.0 0 01/94 sm,m pql 100 25163 256 256 8580f am85c80 169 218 36842 910 53.0 0 01/94 sm,m pql 100 25163 256 256 paetc amd THERMAL test die 102 102 10404 1119 59.8 14.4 0 05/00 1s0p s98061 1118 50.3 200 1169 44.2 400 1168 42.4 600 1168 39.0 800 pql 100 25222 374 374 paetc amd THERMAL test die 314 322 101108 1547 40.2 4.0 0 09/98 1s0p s98067 2616 39.2 4.8 0 2694 31.4 200 2734 28.6 400 2774 26.3 600 2799 24.6 800 pql 100 25222 374 374 paetc amd THERMAL test die 314 322 101108 2148 29.6 4.4 0 09/98 2s2p s98068 3603 28.7 4.6 0 3708 25.1 200 3789 23.2 400 3818 21.8 600 3849 20.7 800 pql 100 25569 374 374 paetc amd THERMAL test die 208 212 44096 1316 51.1 11.3 0 05/00 1s0p s98057 1353 40.7 200 1387 35.3 400 1386 33.4 600 1419 29.9 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 35 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pql 100 25569 374 374 paetc amd THERMAL test die 208 212 44096 1336 50.3 12.8 0 06/00 2s2p s98058 1501 36.7 200 1527 31.9 400 1566 28.0 600 1606 25.5 800 pql 100 25569 374 374 paetc amd THERMAL test die 208 212 44096 1290 52.2 14.1 0 05/00 1s0p s98063 1355 40.9 200 1342 36.0 400 1369 30.9 600 1397 28.3 800 pql 100 25569 374 374 paetc amd THERMAL test die 208 212 44096 1844 36.5 13.8 0 05/00 2s2p s98060 1875 32.2 200 1908 29.5 400 1907 28.5 600 1907 27.5 800 pql 100 25569 374 374 paetc amd THERMAL test die 314 322 101108 1376 48.2 13.6 0 05/00 1s0p s98065 1433 38.2 200 1451 33.2 400 1448 31.0 600 1433 28.0 800 pql 100 25569 374 374 paetc amd THERMAL test die 314 322 101108 2307 28.7 7.6 0 05/00 2s2p s98066 2382 24.9 200 2380 23.1 400 2404 22.1 600 2430 21.3 800 pql 100 34184 5985 am386sx 293 255 74715 1056 52.0 0 04/94 sm,m 1077 40.0 200 1084 37.0 400 1089 32.0 600 1087 29.0 800 1151 7.0 pqr 100 25280 315 315 paetc amd THERMAL test die 208 212 44096 1400 47.9 14.3 0 04/00 1s0p s98053 1437 39.3 200 1470 33.7 400 1470 32.0 600 1504 28.7 800 pqr 100 25280 315 315 paetc amd THERMAL test die 208 212 44096 3017 33.3 7.2 0 09/98 2s2p s98054 3126 28.7 200 3132 27.0 400 3181 25.8 600 3194 24.7 800 pqr 100 25593 376 376 paetc amd THERMAL test die 208 212 44096 2911 34.5 7.4 0 09/98 2s2p s98052 2971 30.3 200 3031 27.6 400 3052 26.0 600 3090 24.8 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 36 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pqr 100 25593 376 376 paetc amd THERMAL test die 314 322 101108 3282 31.1 5.4 0 09/98 2s2p s98056 3366 27.0 200 3396 25.2 400 3424 24.0 600 3453 22.9 800 pqr 100 x25680 157 157 paetc amd THERMAL test die 212 314 66568 1454 46.2 15.0 0 04/00 1s0p s98033 1521 36.2 200 1528 32.8 400 1566 28.9 600 1566 27.0 800 pqr 100 25827 370 470 paetc amd THERMAL test die 420 322 135240 504 36.7 6.1 0 04/97 1s0p 97071 989 34.3 6.0 0 1972 32.2 6.7 0 2034 24.7 200 2064 20.9 400 2086 18.3 600 2116 16.2 800 pqr 100 x26030 215 265 paetc amd THERMAL test die 102 212 21624 1550 57.8 21.5 0 09/98 1s0p 98030 1616 47.7 200 1617 45.7 400 1651 42.0 600 1659 39.8 800 pqr 100 x26030 215 265 paetc amd THERMAL test die 102 212 21624 1632 45.9 18.9 0 09/98 2s2p 98031 1668 40.2 200 1667 39.0 400 1683 37.8 600 1692 36.4 800 prh 100 25114 323 461 69445 mach 445 288 406 116928 1144 38.0 0 03/94 1s0p 1166 33.0 200 1169 28.0 400 1173 26.0 600 1173 24.0 800 1277 5.0 prh 100 25827 370 470 paetc amd THERMAL test chip 212 314 66568 502 23.1 6.2 0 03/97 2s2p 97070 1015 22.2 6.2 0 2027 21.4 6.2 0 2007 17.4 200 2018 16.0 400 2026 14.9 600 2036 13.9 800 prh 100 x25827 370 470 paetc amd THERMAL test chip 420 322 135240 505 20.6 4.0 0 03/97 2s2p 97073 1001 20.0 4.2 0 1992 19.4 5.9 0 2023 15.5 200 2034 14.1 400 2043 13.0 600 2053 11.9 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 37 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pqr 120 23716 350 350 79960a am79c960kc 252 260 65520 343 49.7 0 10/92 sm,m 419 41.2 200 416 37.9 400 417 34.9 600 418 33.3 800 418 32.4 1000 372 12.2 pqr 120 23716 350 350 77640a am79c864 267 272 72624 600 43.0 0 08/92 so,m 538 38.0 200 541 32.0 400 543 29.0 600 544 26.0 800 543 25.0 1000 pqr 120 24412 300 300 79960ar am79c960 252 260 65520 418 45.0 0 05/93 sm,m 433 39.0 200 424 35.0 400 423 33.0 600 425 32.0 800 426 31.0 1000 421 13.0 cg 132 23936 345 385 5983a am386-dx 255 293 74715 618 22.0 0 01/91 so,m 622 19.0 150 625 17.0 300 624 16.0 450 627 14.0 600 639 3.0 pqb 132 23705 350 350 5983 am386tmdx 255 293 74715 245 41.0 0 04/93 sm,m 245 8.0 245 32.0 200 245 30.0 400 245 27.0 600 pqb 132 25108 440 440 1124ar am79c974 381 393 149733 418 49.0 0 02/94 sm,m 353 38.0 200 351 35.0 400 351 32.0 600 350 29.0 800 418 10.0 pqb 132 24374 370 370 79961ar 79c961kc 260 265 68900 288 45.0 0 01/94 sm,m 299 39.0 200 329 34.0 400 306 30.0 600 303 27.0 800 305 10.0 gqd 144 24081 422 652 29030a2 am29030a2 328 592 194176 2428 29.0 0 01/92 sm,m 3085 26.0 200 2946 23.0 400 2593 20.0 600 2565 18.0 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 38 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code gqd 144 24081 422 652 29030a2 am29030a2 328 592 194176 2068 35.0 0 01/92 so,m 2151 27.0 200 2110 18.0 400 2063 15.0 600 2060 13.0 800 gqd 144 24081 422 652 29030 29030 330 592 195360 3110 28.0 0 11/92 sm,m 3145 27.0 100 3128 25.0 200 3140 22.0 400 2513 8.0 gqd 144 24181 29030dr am29030dr 328 592 194176 2000 30.0 0 03/94 sm,m 2000 26.0 200 2000 23.0 400 2000 8.0 gqd 144 24181 29030dr am29030dr 328 592 194176 2000 39.0 03/94 so,m 2000 29.0 200 2000 21.0 400 gqd 144 24181 29030dr am29030dr 328 592 194176 3000 29.0 0 03/94 sm,m 3000 26.0 200 3000 23.0 400 3000 8.0 gqd 144 24181 29030dr am29030dr 328 592 194176 3000 36.0 0 03/94 so,m 3000 28.0 200 3000 21.0 400 gqd 144 24181 29030dr am29030dr 328 592 194176 4000 29.0 7.0 0 03/94 sm,m 4000 26.0 200 4000 23.0 400 gqd 144 24181 29030dr am29030dr 328 592 194176 4000 35.0 0 03/94 so,m gqd 144 24407 430 672 29030dr am 29030dr 430 592 254560 3308 31.0 0 09/93 sm,m 3536 28.0 200 3654 25.0 400 3695 22.0 600 3748 20.0 800 3707 7.0 pdl 144 25369 394 394 paetc amd THERMAL test chip 208 212 44096 2295 44.8 8.2 0 08/98 1s0p s98089 2372 36.9 200 2417 33.2 400 2456 30.1 600 2486 27.8 800 pdl 144 25369 394 394 paetc amd THERMAL test chip 208 212 44096 3439 29.5 6.4 0 09/98 2s2p s98090 3524 26.1 200 3531 24.9 400 3578 23.3 600 3616 22.2 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 39 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pdl 144 25369 394 394 paetc amd THERMAL test chip 314 322 101108 2274 45.5 12.2 0 08/98 1s0p s98087 2338 38.2 200 2379 34.6 400 2403 31.0 600 2427 28.2 800 pdl 144 25369 394 394 paetc amd THERMAL test chip 314 322 101108 3719 27.1 5.1 0 07/98 2s2p s98088 3804 23.4 200 3834 22.2 400 3859 20.3 600 3865 19.1 800 pdr 144 25228 380 380 29042aw am29040 (cs24) 317 327 103659 492 37.5 0 06/95 1s0p 565 28.2 200 567 25.7 400 560 23.0 600 552 21.4 800 510 11.1 pdr 144 25228 380 380 29042aw am29040 (cs24e) 317 327 103659 509 40.3 0 06/95 1s0p 511 29.7 200 511 26.1 400 511 24.2 600 511 23.4 800 pdr 144 25228 380 380 29042aw am29040 (cs24e) 317 327 103659 598 35.7 0 06/95 1s0p 546 29.4 200 544 27.5 400 583 24.3 600 582 21.8 800 502 7.6 pdr 144 25228 380 380 29042aw am29040 (cs24e) 317 327 103659 1196 39.0 0 06/95 1s0p 1175 8.3 pqr 144 23981 630 380 29035a1 am29035a1 325 592 192400 2071 29.0 0 09/91 sm,m 2180 26.0 150 2166 23.0 300 2187 21.0 500 2187 20.0 700 pqr 144 23981 630 380 29035b1 am29035b1 328 592 194176 2164 32.0 0 03/92 sm,m 2231 31.0 150 2211 28.0 300 2216 25.0 500 2219 23.0 700 pqr 144 24169 630 380 29030dr am29030dr 328 592 194176 2000 29.0 0 03/94 sm,m 2000 27.0 200 2000 25.0 400 2000 7.0 pqr 144 24169 630 380 29030dr am29030dr 328 592 194176 2000 33.0 0 03/94 so,m 2000 27.0 200 2000 22.0 400 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 40 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pqr 144 24169 630 380 29030dr am29030dr 328 592 194176 2022 33.8 0 09/94 sm,m 1980 29.8 200 2010 26.3 400 2007 6.2 pqr 144 24169 630 380 29030dr am29030dr 328 592 194176 2025 32.0 0 09/94 so,m 1964 27.2 200 2016 22.2 400 pqr 144 24169 630 380 29030dr am29030dr 328 592 194176 3000 30.0 0 03/94 sm,m 3000 28.0 200 3000 25.0 400 3000 7.0 pqr 144 24169 630 380 29030dr am29030dr 328 592 194176 3000 32.0 0 03/94 so,m 3000 27.0 200 3000 22.0 400 pqr 144 24169 630 380 29030dr am29030dr 328 592 194176 3008 32.3 0 09/94 sm,m 2986 29.1 200 3010 25.8 400 3007 6.1 pqr 144 24169 630 380 29030dr am29030dr 328 592 194176 3031 32.2 0 09/94 so,m 3038 26.7 200 3013 22.2 400 pqr 144 24169 630 380 29030dr am29030dr 328 592 194176 4000 29.0 0 03/94 sm,m 4000 28.0 200 4000 25.0 400 4000 7.0 pqr 144 24169 630 380 29030dr am29030dr 328 592 194176 4000 31.0 0 03/94 so,m 4000 27.0 200 4000 25.0 400 pqr 144 24169 630 380 29030dr am29030dr 328 592 194176 4008 31.0 0 09/94 sm,m 3959 28.8 200 4008 25.6 400 4006 6.0 pqr 144 24169 630 380 29030dr am29030dr 328 592 194176 4011 31.1 0 09/94 so,m 3850 26.6 200 4011 22.0 400 pqr 144 25228 380 380 29044bq am29044 254 262 66548 1164 34.1 7.0 0 08/96 1s0p 1090 28.0 200 1035 27.0 400 1049 26.0 600 1062 25.0 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 41 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pqr 144 25228 380 380 29044bq am29044 254 262 66548 609 43.0 6.4 0 08/96 so2 s98049 684 34.0 200 679 28.3 400 671 26.0 600 678 24.2 800 pqr 144 25228 380 380 29042ar am29040 317 327 103659 492 37.5 03/95 1s0p pqr 144 25228 380 380 29042aw am29040 317 327 103659 598 35.7 0 03/95 1s0p pqr 144 25568 386 386 paetc amd THERMAL test chip 208 212 44096 3626 30.4 16.4 0 06/98 1s0p s98050 3692 25.1 200 3754 22.0 400 3821 20.4 600 3853 18.9 800 pqr 144 25568 386 386 paetc amd THERMAL test chip 208 212 44096 3188 32.1 6.6 0 08/98 2s2p s98047 3254 22.1 200 3304 18.5 400 3354 18.2 600 3386 17.0 800 pqr 144 25568 386 386 paetc amd THERMAL test chip 314 322 101108 2843 36.0 10.1 0 08/98 1s0p s98048 2925 29.8 200 2952 27.4 400 3007 24.7 600 3024 22.9 800 pqr 144 25568 386 386 paetc amd THERMAL test chip 314 322 101108 3597 28.1 5.2 0 08/98 2s2p 98032 3700 25.0 200 3706 23.5 400 3738 21.8 600 3768 21.3 800 pqr 144 x26077 240 260 paetc amd THERMAL test chip 208 212 44096 2585 45.1 15.1 0 10/98 1s0p 98033 2647 39.1 200 2679 37.0 400 2733 33.3 600 2756 31.3 800 pqr 144 x26077 240 260 paetc amd THERMAL test chip 208 212 44096 2674 38.2 13.0 0 10/98 2s2p 2729 34.4 200 2745 33.3 400 2768 31.6 600 2807 29.4 800 prh 144 25181 340 400 68355 mach 355 314 356 111784 1022 25.0 0 08/94 sm,m 1013 21.0 200 1016 18.0 400 1017 16.0 600 1015 15.0 800 prh 144 25181 340 400 68355 mach 355 314 356 111784 1061 19.6 0 07/95 so,m prh 144 25181 340 400 68355 mach 355 314 356 111784 1092 19.4 0 07/95 so,m msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 42 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pqt 144 25378 394 394 79930am am79c930 313 319 99847 607 37.4 0 06/95 2s1p 561 31.0 200 568 28.5 400 568 26.9 600 568 26.6 800 604 6.9 cg 145 23992 435 681 29030ap am29030 328 592 194176 3000 23.0 0 06/91 so,m 3000 21.0 150 3000 19.0 300 3000 16.0 500 3000 15.0 700 3000 3.0 cgm 145 25229 410 410 29042aw am29040 317 327 103659 1055 26.4 0 02/95 so cgm 145 25539 320 330 29044bq am29044 254 262 66548 1 26.8 4.6 0 05/96 so 581 17.8 200 562 15.4 400 576 13.1 600 564 11.7 800 cgx 145 15444 505 505 77184f am77184f 314 317 99538 644 27.0 0 06/92 so,m 647 22.0 200 650 18.0 400 652 15.0 600 651 14.0 800 623 3.0 cgx 145 15444 505 505 77220ex am77220ex 314 317 99538 785 26.0 0 06/92 so,m 759 21.0 200 744 16.0 400 741 14.0 600 740 12.0 800 696 2.0 cgx 145 15444 505 505 77200ex am77200ex 314 317 99538 800 33.0 0 06/92 so,m 803 26.0 200 794 21.0 400 800 17.0 600 802 16.0 800 793 3.0 cgx 145 15444 505 505 77200e am79c82b 314 317 99538 1136 26.0 0 11/92 so,m 1160 21.0 200 1169 16.0 400 1174 15.0 600 1124 2.0 cgx 145 25539 320 330 paetc amd THERMAL test chip 208 212 44096 1430 23.7 1.3 3.7 0 08/96 so6 1510 15.9 200 1537 14.1 400 1549 13.2 600 1528 12.5 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 43 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pqe 160 25578 428 428 5937c am 486 slug 298 284 84632 2776 12.9 1.7 0 03/96 2s2p 3149 7.8 200 3164 6.5 400 3134 5.6 600 3141 5.0 800 pqr 160 24134 400 400 77184f 314 317 99538 614 36.0 0 09/92 so,m 612 33.0 200 616 27.0 400 617 24.0 600 617 22.0 800 661 10.0 pqr 160 24134 400 400 77220e ?? 314 317 99538 735 37.0 0 09/92 so,m 715 32.0 200 714 26.0 400 715 23.0 600 717 21.0 800 698 10.0 pqr 160 24134 400 400 77200e 314 317 99538 883 37.0 0 09/92 so,m 881 33.0 200 888 27.0 400 890 24.0 600 895 22.0 800 494 10.0 pqr 160 24134 400 400 29000 am29000 322 326 104972 2828 26.0 0 01/92 sm,m 2885 23.0 200 2940 20.0 400 3028 18.0 600 3085 17.0 800 pqr 160 24134 400 400 29001ap am29001ap 322 326 104972 1329 39.0 0 03/92 sm,m 1301 34.0 200 1317 32.0 400 1334 29.0 600 1336 28.0 800 1271 11.0 pqr 160 24134 400 400 29001ap am29001ap 322 326 104972 1309 37.0 0 05/92 sm,m 1338 33.0 200 1351 31.0 400 1380 28.0 600 1326 27.0 800 1420 10.0 pqr 160 24134 400 400 29200ar 29200ar 337 345 116265 1433 36.0 0 11/91 sm,m 1444 32.0 1344 29.0 1345 27.0 2035 8.0 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 44 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pqr 160 24154 394 394 29000 am29000 322 326 104972 1339 31.0 0 10/90 sm,m 1382 25.0 200 1413 22.0 400 1414 21.0 600 pqr 160 23006 484 484 77100a am79c82a 394 413 162722 503 40.0 0 09/90 sm,m 540 36.0 150 532 33.0 300 531 29.0 480 552 27.0 700 557 26.0 900 pqr 160 24338 340 340 79965a am79965a 289 298 86122 500 40.0 0 12/93 1s0p 500 35.0 200 500 33.0 400 500 30.0 600 500 28.0 800 500 12.0 1s0p pqr 160 24338 340 340 79965a am79965a 289 298 86122 500 43.0 0 11/93 so,m 500 34.0 200 500 30.0 400 500 26.0 600 500 25.0 800 pqr 160 24584 340 340 79965a am79965a 289 298 86122 363 41.0 0 10/93 1s0p 371 38.0 200 377 35.0 400 377 34.0 600 375 31.0 800 pqr 160 24584 340 340 79965a am79965a 289 298 86122 428 40.8 0 07/95 1s0p 376 31.5 200 441 10.6 pqr 160 24584 340 340 79965a am79965a 289 298 86122 498 41.0 0 09/93 so,m s98069 493 37.0 200 483 31.0 400 500 29.0 600 502 25.0 800 pqr 160 25264 354 354 paetc amd THERMAL test die 314 322 101108 2823 36.4 8.5 0 08/98 1s0p s98070 2930 30.5 200 2977 27.4 400 2970 25.3 600 2979 23.9 800 pqr 160 25264 354 354 paetc amd THERMAL test die 314 322 101108 3429 29.5 9.5 0 08/98 2s2p 98014 3548 25.1 200 3585 23.3 400 3617 22.0 600 3634 21.1 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 45 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pqr 160 25264 354 354 paetc amd THERMAL test die 208 212 44096 1223 44.8 12.6 0 04/98 1s0p 98010 1258 37.0 200 1263 35.3 400 1281 31.9 600 1286 29.6 800 pqr 160 25264 354 354 paetc amd THERMAL test die 208 212 44096 2374 36.7 13.4 0 04/98 2s2p s98071 2414 33.1 200 2430 31.9 400 2454 30.4 600 2470 28.7 800 pqr 160 25497 472 472 paetc amd THERMAL test die 420 432 181440 3179 32.0 6.1 0 08/98 1s0p s98074 3265 26.3 200 3313 23.0 400 3371 20.5 600 3371 19.4 800 pqr 160 25497 472 472 paetc amd THERMAL test die 314 322 101108 2088 31.4 8.5 0 06/00 1s0p s98073 2163 26.4 200 2185 23.9 400 2232 20.3 600 2254 17.8 800 pqr 160 25497 472 472 paetc amd THERMAL test die 314 322 101108 3350 30.2 5.4 0 10/98 2s2p s98075 3423 26.3 200 3452 24.7 400 3495 23.3 600 3532 21.7 800 pqr 160 25497 472 472 paetc amd THERMAL test die 420 432 181440 3251 31.4 5.0 0 11/98 1s0p s98076 3350 25.8 200 3407 22.7 400 3470 19.7 600 3491 18.1 800 pqr 160 25497 472 472 paetc amd THERMAL test die 420 432 181440 3179 32.0 6.1 0 06/00 2s2p s98072 3265 26.3 200 3313 23.0 400 3371 20.5 600 3371 19.4 800 pqr 160 25524 550 550 paetc amd THERMAL test die 420 432 181440 1578 16.0 3.8 0 05/98 2s2p s98077 3952 15.3 3.3 0 6734 15.1 3.4 0 7034 12.3 200 7119 11.1 400 7221 9.9 600 7281 9.2 800 pqr 160 25524 550 550 paetc amd THERMAL test die 314 322 101108 3099 32.9 5.6 0 12/98 1s0p s98078 3190 27.8 200 3251 24.0 400 3309 21.7 600 3338 20.3 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 46 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pqr 160 25524 550 550 paetc amd THERMAL test die 314 322 101108 4756 21.7 2.9 0 12/98 2s2p 96054 4866 18.8 200 4921 17.3 400 4955 16.1 600 5031 14.8 800 pqr 160 25524 550 550 79971ar am79c971 435 437 190095 737 25.4 6.0 0 09/96 2s2p 98034 786 20.9 200 786 18.9 400 786 17.4 600 786 15.8 800 pqr 160 x26029 260 260 paetc amd THERMAL test die 208 212 44096 2582 46.5 16.1 0 10/98 1s0p 98035 2661 40.5 200 2659 39.0 400 2730 35.3 600 2768 32.3 800 pqr 160 x26029 260 260 paetc amd THERMAL test die 208 212 44096 2649 40.2 13.5 0 10/98 2s2p 2713 36.1 200 2728 35.0 400 2759 32.9 600 2783 31.1 800 prh 160 25874 413 413 paetc amd THERMAL test die 208 212 44096 1215 24.2 6.1 0 05/97 1s0p 97106 2883 22.5 6.3 0 4845 21.4 6.4 0 5043 17.2 200 5158 15.0 400 5296 12.6 600 2367 11.5 800 prh 160 25874 413 413 paetc amd THERMAL test die 208 212 44096 1686 17.8 5.1 0 05/97 2s2p 97107 3839 16.9 5.5 0 6474 13.5 6.0 0 6706 13.5 200 6816 12.2 400 6933 11.0 600 6993 10.4 800 prh 160 25874 413 413 paetc amd THERMAL test die 314 322 101108 1191 24.1 6.1 0 05/97 1s0p 97108 2885 22.1 6.0 0 4969 20.9 6.0 0 5157 16.6 200 5271 14.3 400 5398 12.0 600 5465 10.8 800 prh 160 25874 413 413 paetc amd THERMAL test die 314 322 101108 1830 16.0 3.8 0 05/97 2s2p 97109 4231 15.2 3.9 0 7096 14.7 4.0 0 7324 12.2 200 7447 11.0 400 7591 9.8 600 7664 9.1 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 47 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code prh 160 25873 449 449 paetc amd THERMAL test die 314 432 135648 1214 23.1 7.2 0 05/97 1s0p 97110 2938 21.5 6.9 0 5033 20.5 6.8 0 5229 16.2 200 5367 13.6 400 5485 11.5 600 5549 10.5 800 prh 160 25873 449 449 paetc amd THERMAL test die 314 432 135648 1767 16.1 4.8 0 05/97 2s2p 97111 4179 15.2 4.8 0 7086 14.6 4.9 0 7318 12.1 200 7446 10.8 400 7567 9.7 600 7632 9.1 800 prh 160 25873 449 449 paetc amd THERMAL test die 420 432 181440 1171 24.0 6.8 0 05/97 1s0p 97111a 2816 22.4 6.4 0 4762 21.6 6.8 0 4935 17.5 200 5050 15.0 400 5168 12.7 600 5230 11.5 800 prh 160 25873 449 449 paetc amd THERMAL test die 420 432 181440 1232 23.3 5.5 0 05/97 1s0p 97112 2953 21.6 5.2 0 5043 20.6 5.3 0 5323 16.6 200 5345 13.7 400 5442 11.8 600 5487 10.8 800 prh 160 25873 449 449 paetc amd THERMAL test die 420 432 181440 1666 17.4 4.8 0 05/97 2s2p 97112a 3880 16.5 4.8 0 6500 16.0 4.9 0 6693 13.3 200 6798 11.9 400 6896 10.7 600 6945 10.1 800 prh 160 25873 449 449 paetc amd THERMAL test die 420 432 181440 1785 15.8 3.8 0 05/97 2s2p 98042 4175 15.2 3.8 0 7072 14.6 3.9 0 7240 12.2 200 7377 10.8 400 7428 9.9 600 7481 9.3 800 prh 160 26093 275 275 paetc amd THERMAL test die 208 212 44096 3122 25.5 6.7 0 10/98 2s2p 3187 23.0 200 3208 21.9 400 3236 20.6 600 3269 19.1 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 48 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code ctq 164 21792 514 514 29000 am29000 435 450 195750 2778 26.0 0 07/90 sm,m 2866 24.0 200 3001 21.0 400 3090 19.0 600 2506 3.0 cgm 168 24361 445 465 5972b am486 360 380 136800 1609 20.0 0 03/94 sm,m 1699 1.0 cgm 168 24361 445 465 5973a am486 360 384 138240 1247 19.0 0 12/93 sm,m 1341 14.0 200 1434 11.0 400 1404 8.0 600 1377 7.0 800 1301 2.0 cgm 168 24361 445 465 5970 am486 dx-50 360 384 138240 1243 17.0 0 08/92 so,m 1457 16.0 200 1481 13.0 400 1483 11.0 600 1290 3.0 pqr 168 21792 514 514 29005 am29005 435 450 195750 2118 33.0 0 08/90 sm,m 2225 30.0 200 2311 28.0 400 2374 27.0 600 pqr 168 23703 497 497 2900e am29000e 440 440 193600 2603 26.0 0 04/91 sm,m pqr 168 24134 400 400 77184f ?? 314 317 99538 631 36.0 0 07/92 sm,m 643 31.0 200 645 29.0 400 645 28.0 600 642 26.0 800 641 11.0 pqr 168 24134 400 400 77200e ?? 314 317 99538 913 37.0 0 07/92 sm,m 965 33.0 200 962 31.0 400 970 29.0 600 973 28.0 800 698 12.0 pqr 168 24134 400 400 29000gir am29000f 322 326 104972 2424 38.0 0 08/93 sm,m 2532 35.0 200 2627 32.0 400 2701 29.0 600 2765 27.0 800 3354 9.0 pqr 168 24134 400 400 29000gir am29000f 322 326 104972 2745 35.0 0 08/93 sm,m 2718 32.0 200 2635 27.0 400 2800 24.0 600 2706 23.0 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 49 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pqr 168 46520 am46520 327 342 111834 2043 36.0 200 10/90 sm,m 2022 33.0 400 2008 31.0 600 cgx 169 23997 425 425 29000fp am29000fp 322 326 104972 1797 22.0 0 10/91 so,m 1873 18.0 200 1901 16.0 400 1939 14.0 600 lqe 176 26222 260 300 paetc amd THERMAL test die 208 212 44096 3428 21.8 3.9 0 05/99 1s0p 99008 3573 17.5 200 3645 15.1 400 3703 13.0 600 3740 11.9 800 lqe 176 26222 260 300 paetc amd THERMAL test die 208 212 44096 6458 13.1 2.2 0 05/99 2s2p 99009 6575 11.1 200 6684 10.1 400 6765 9.1 600 6825 8.5 800 pql 176 x25960 315 315 paetc amd THERMAL test die 208 212 44096 2345 27.9 7.9 0 08/98 2s2p 98011 2401 24.0 200 2408 22.8 400 2414 22.0 600 2436 21.2 800 pql 176 x25960 315 315 paetc amd THERMAL test die 208 212 44096 1560 40.4 11.3 0 08/98 1s0p 98015 1594 33.4 200 1617 30.6 400 1629 28.5 600 1640 27.2 800 cot 192 24199 79950b curio 342 347 118674 253 61.4 31.4 0 03/96 sm 251 51.7 200 252 45.0 400 246 41.4 600 246 37.6 800 cot 192 24199 79950b curio 342 347 118674 268 60.9 30.5 0 04/96 sm 239 47.8 200 252 38.7 400 233 34.7 600 231 31.7 800 pqb 196 24192 420 420 29240bo am 29240bo 372 380 141360 1000 38.5 0 08/94 sm,m pqb 196 24192 420 420 29240b3 am29240 372 380 141360 1263 37.1 0 11/94 sm,m 1264 9.2 pqb 196 24192 420 420 29240b3 am29240 372 380 141360 1271 38.1 0 11/94 so,m pde 208 25336 458 458 6137cy 284 298 84632 3608 14.3 1.4 0 03/96 2s2p msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 50 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pde 208 25560 429 429 5937c am 486 458 458 209764 2832 14.2 1.7 0 03/96 2s2p 1976 8.7 200 1961 7.4 400 1986 6.4 600 2009 5.8 800 pde 208 25559 458 458 5937c am 486 458 458 209764 2.614 13.6 0 03/96 2s2p 2.899 8.2 200 2.944 7.2 400 2.956 5.9 600 2.936 5.0 800 pde 208 25559 458 458 5937c am 486 458 458 209764 2165 13.3 0.9 0 03/96 2s2p 2607 9.4 200 2571 7.9 400 2475 6.5 600 2470 6.0 800 pde 208 25559 458 458 5937c am 486 458 458 209764 2.554 13.2 0 03/96 2s2p 2.231 7.7 200 2.238 6.7 400 2.263 5.3 600 2.228 4.6 800 pde 208 25559 458 458 5937c am 486 458 458 209764 2.557 13.3 0 01/96 2s2p 98002 3.048 8.5 200 3.022 7.5 400 2.994 6.0 600 2.981 5.3 800 pde 208 25650 570 570 paetc amd THERMAL test die 420 432 181440 4116 15.6 0 03/98 2s4p 98009 4253 11.2 200 4310 9.6 400 4330 8.8 600 4347 8.2 800 pde 208 25650 570 570 paetc amd THERMAL test die 420 432 181440 4119 14.1 0 03/98 2s4p 99014 4301 9.1 200 4346 7.6 400 4368 7.2 600 4385 6.8 800 pde 208 26669 374 374 paetc amd THERMAL test die 314 322 101108 5342 17.6 1.9 0 04/99 1s0p 99015 5547 13.9 200 5681 11.7 400 5785 9.8 600 5872 8.4 800 pde 208 26669 374 374 paetc amd THERMAL test die 314 322 101108 5609 12.0 1.4 0 04/99 2s2p 98001a 5791 9.5 200 5881 8.2 400 5942 7.3 600 5967 6.6 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 51 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pde 208 unknown paetc amd THERMAL test die 314 322 101108 5415 11.6 0 03/98 2s2p 98008 5825 6.4 200 5901 5.2 400 5958 4.6 600 5989 4.0 800 pde 208 unknown paetc amd THERMAL test die 314 322 101108 5412 12.9 0 03/98 2s2p s98079 5654 8.8 200 5754 7.2 400 5821 6.2 600 5891 5.5 800 pqe 208 25573 458 458 paetc amd THERMAL test die 208 212 44096 5422 18.9 2.9 0 10/98 1s0p s98080 5682 14.8 200 5817 12.4 400 5986 10.1 600 6087 8.9 800 pqe 208 25573 458 458 paetc amd THERMAL test die 208 212 44096 7343 13.8 2.1 0 10/98 2s2p 98054 7679 10.7 200 7808 9.4 400 7954 8.4 600 8088 7.6 800 pqe 208 25573 458 458 paetc amd THERMAL test die 420 322 135240 3444 19.1 4.8 0 05/00 1s0p s98081 3597 14.3 200 3649 12.3 400 3725 9.7 600 3748 8.4 800 pqe 208 25573 458 458 paetc amd THERMAL test die 420 322 135240 4855 13.6 3.0 0 06/00 2s2p s98082 5043 11.0 200 5137 9.3 400 5198 7.9 600 5227 7.3 800 pqe 208 x26213 433 433 paetc amd THERMAL test die 314 322 101108 5188 20.3 4.2 0 03/99 2s2p 5327 17.8 200 5388 16.6 400 5464 15.0 600 5517 14.0 800 pqr 208 24192 420 420 5970 am 486 dx 50 360 384 138240 850 29.0 0 10/92 sm,m 852 25.0 200 874 23.0 400 867 22.0 600 865 20.0 800 992 7.0 pqr 208 24505 470 470 77400ar am79c850 408 428 174624 1031 27.9 0 06/95 1s0p 1042 22.5 200 1060 20.3 400 1048 18.8 600 1035 17.6 800 1010 6.2 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 52 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pqr 208 24505 470 470 77400ar am79c850 408 428 174624 1115 34.7 0 06/95 so 1025 26.3 200 1050 21.5 400 1059 19.3 600 1062 18.3 800 pqr 208 24585 430 430 68465a mach 465 430 430 184900 1518 22.9 0 12/94 so,m pqr 208 24700 506 506 5977b am 486xl 372 387 143964 1370 36.0 0 04/94 sm,m 1394 32.0 200 1406 29.0 400 1389 27.0 600 1384 26.0 800 1413 8.0 pqr 208 25501 394 394 29248 am29240eh 247 262 64714 513 36.5 0 01/96 sm,6lyr 747 34.0 200 772 32.6 400 788 31.4 600 809 29.6 800 pqr 208 25501 394 394 29248 am29240eh 247 262 64714 735 32.5 4.7 0 05/96 2s2p 673 26.4 200 680 24.8 400 706 22.8 600 704 21.8 800 prh 208 24585 430 430 68465a mach 465 430 430 184900 2195 16.1 0 04/95 2s2p 2281 12.4 200 2267 11.6 400 2280 10.3 600 2308 9.5 800 prh 208 25699 396 396 paetc hsk heat sink 208 212 44096 2502 20.6 5.5 0 10/96 1s0p 96062 2367 17.7 4.5 0 10/96 2s2p 96074 2405 22.5 5.4 0 10/96 1s0p 96064 2426 18.0 4.2 0 10/96 2s2p 96076 prh 208 25699 396 396 paetc hsk heat sink 314 322 101108 2338 19.8 4.1 0 10/96 1s0p 96063 2637 16.4 3.6 0 10/96 2s2p 96075 2469 20.4 4.5 0 10/96 1s0p 96065 2572 16.5 4.0 0 10/96 2s2p 96077 prh 208 26212 405 405 paetc amd THERMAL test die 314 322 101108 5367 16.5 3.1 0 03/99 2s2p 98053 5529 14.2 200 5604 12.8 400 5676 11.5 600 5730 10.7 800 pqr 216 23735 539 539 5961bx am286tm bx 489 506 247434 1332 32.0 0 09/91 sm,m 1230 24.0 200 1242 21.0 400 1325 20.0 600 1243 18.0 800 1270 6.0 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 53 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code pqr 216 23735 539 539 5961bx am286tm bx 489 506 247434 1825 30.0 0 09/91 sm,m 1844 24.0 200 1786 21.0 400 1796 19.0 600 1835 18.0 800 pqr 216 23735 539 539 5961ax am286lx 489 506 247434 3005 28.0 0 05/91 sm,m 2995 27.0 100 3020 23.0 200 3027 18.0 400 3008 17.0 600 pqr 216 24505 470 470 46505 46505 327 342 111834 1057 33.0 0 11/93 sm,m 996 31.0 200 993 28.0 400 990 26.0 600 987 24.0 800 pqe 240 25579 512 512 5937c am 486 slug 298 284 84632 2594 11.5 1.3 0 04/96 2s2p 877 6.3 200 867 5.4 400 897 4.4 600 875 4.1 800 3784 1.8 pqe 240 25579 512 512 5937c am 486 slug 298 284 84632 2594 11.5 1.3 0 03/96 2s2p 96068 3218 6.8 200 3229 5.5 400 3175 4.6 600 3203 4.0 800 bga 256 25646 362 362 paetc 3 x 3 314 322 101108 1492 41.1 8.9 0 08/96 2s2p bgd 256 26074 330 330 paetc amd THERMAL test die 208 212 44096 4326 17.5 3.6 0 03/01 2s2p 21061 4468 14.0 200 4521 12.8 400 4563 11.8 600 4587 11.3 800 bga 272 27118 363 363 paetc amd THERMAL test die 314 322 101108 4003 21.1 2.2 0 02/01 2s2p 21060 4095 18.1 200 4130 16.9 400 4160 16.0 600 4174 15.5 800 bga 272 27120 430 430 paetc amd THERMAL test die 314 322 101108 3979 16.3 4.2 0 12/00 2s2p 20020 4063 13.8 200 4097 12.6 400 4122 11.9 600 4136 11.5 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 54 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code bga 272 27120 430 430 paetc amd THERMAL test die 314 322 101108 4337 14.0 4.1 0 12/00 2s2p 20021 4446 11.5 200 4490 10.4 400 4509 9.7 600 4527 9.2 800 bgu 272 27119 363 363 paetc amd THERMAL test die 314 322 101108 4200 15.6 4.3 0 02/01 2s2p 21047 4295 12.7 200 4345 11.5 400 4377 10.6 600 4392 10.2 800 bga 292 25675 362 362 paetc amd ttd 420 432 181440 501 58.0 8.4 0 04/97 so 97078 1152 55.5 8.1 0 1924 53.8 8.3 0 1939 48.1 200 1965 41.3 400 1995 34.9 600 2016 32.2 800 bga 292 25675 362 362 paetc amd ttd 420 432 181440 530 58.6 6.9 0 04/97 so 97079 1181 55.9 6.9 0 1955 54.1 6.9 0 1983 48.7 200 2021 41.5 400 2052 36.1 600 2067 33.2 800 bga 292 26739 402 405 paetc amd ttd 314 322 101108 3497 21.5 2.7 0 08/01 2s2p 21097 3592 18.2 200 3627 17.0 400 3650 16.2 600 3667 15.6 800 cgm 296 25415 920 590 ncrttd ncr THERMAL test die 450 750 337500 12000 13.7 1.2 0 06/96 so 95141 12000 10.4 200 12000 9.6 400 cgm 296 25242 900 560 ncrttd ncr THERMAL test die 450 750 337500 12000 10.2 0.6 0 06/96 so 95140 12000 7.5 200 12000 6.6 400 cgm 296 25423 895 565 ncrttd ncr THERMAL test die 450 750 337500 12000 9.5 0.4 0 06/96 so 95139 12000 6.9 200 12000 5.9 400 cgm 296 25415 920 590 ncrttd ncr THERMAL test die 450 750 337500 14000 7.2 1.2 0 06/96 so 96082 14000 4.7 200 14000 3.9 400 cgm 296 25242 900 560 ncrttd ncr THERMAL test die 450 750 337500 14000 6.3 0.6 0 06/96 so 96098 14000 4.2 200 14000 3.2 400 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 55 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code cgm 296 25423 895 565 ncrttd ncr THERMAL test die 450 750 337500 14000 6.0 0.4 0 06/96 so 96082 14000 3.6 200 14000 2.9 400 cge 296 25676 741 504 paetc amd THERMAL test die 420 652 273840 14664 9.9 1.1 0 97114 15671 0.5 0 10/96 so cge 296 25676 741 504 paetc amd THERMAL test die 420 652 273840 10137 0.8 0 12/96 so 98003 pga 296 25676 741 504 paetc amd THERMAL test die 420 652 273840 14856 9.9 1.1 0 10/96 so cgf 321 25755 paetc amd THERMAL test die 420 652 273840 15040 9.7 0.6 2.5 0 07/97 so cgf 321 25755 paetc amd THERMAL test die 314 322 101108 15037 10.0 1.1 2.5 0 02/98 so cgf 321 25755 paetc amd THERMAL test die 420 652 273840 13847 0.8 1.6 0 12/98 2s2p - so 98045 bga 352 25581 460 460 paetc amd THERMAL test die 314 322 101108 4117 11.6 0.6 0 06/96 2s2p 3713 7.3 200 3674 6.3 400 3591 5.8 600 3666 5.4 800 bga 352 26006 461 461 paetc amd THERMAL test die 314 322 101108 2469 11.0 2.0 0 03/98 2s2p 98036 5997 10.4 2.1 0 10162 10.0 2.3 0 6983 8.5 200 7076 7.3 400 7166 6.6 600 7218 6.0 800 bgd 352 x25811 453 453 paetc amd THERMAL test die 208 212 44096 3962 12.4 2.1 0 03/97 2s2p 3950 9.1 200 4021 8.3 400 4018 7.4 600 4043 6.8 800 4066 1.3 0 bgd 352 x25811 453 453 paetc amd THERMAL test die 314 322 101108 4051 11.4 1.7 0 03/97 2s2p 97152 4057 8.2 9.1 200 4089 7.3 8.3 400 4116 6.5 7.4 600 4140 5.9 6.8 800 4048 1.0 0 bgd 352 26094 470 440 paetc amd THERMAL test die 420 432 181440 8792 10.8 1.5 0 06/98 2s1p 97153 9090 8.5 200 9239 7.3 400 9343 6.6 600 9414 6.2 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 56 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code bgd 352 26001 389 389 paetc amd THERMAL test die 314 322 101108 2219 12.6 1.9 0 03/98 2s2p 97154 5180 12.5 2.5 0 8730 12.8 3.4 0 4936 9.7 200 4998 8.5 400 5032 7.8 600 5069 7.4 800 bgd 352 26812 389 389 paetc amd THERMAL test die 314 322 101108 6228 11.8 2.5 0 04/00 2s2p 99063 6396 9.8 200 6466 8.8 400 6519 8.2 600 6546 7.8 800 7539 2.4 0 bgd 352 27017 590 590 paetc amd THERMAL test die 420 432 181440 7592 9.3 1.2 0 11/00 2s2p 20013 7727 7.7 200 7797 6.8 400 7837 6.3 600 7864 6.0 800 8275 1.3 0 bga 388 ase 341 341 paetc amd THERMAL test die 208 212 44096 1569 41.5 13.0 0 10/98 1s0p 98038 1624 34.6 200 1635 31.2 400 1654 28.8 600 1660 27.5 800 bga 388 ase 341 341 paetc amd THERMAL test die 208 212 44096 1355 30.7 13.9 0 10/98 1s0p 98037 1393 21.9 200 1408 19.2 400 1416 17.7 600 1436 17.0 800 bga 388 ase 341 341 paetc amd THERMAL test die 208 212 44096 1582 26.6 7.7 0 10/98 2s2p 98039 1603 23.0 200 1611 21.7 400 1616 20.9 600 1621 20.3 800 bga 388 ase 341 341 paetc amd THERMAL test die 208 212 44096 1610 41.6 13.2 0 11/98 so,1s0p 98041 1629 39.1 200 1666 33.1 400 1689 29.2 600 1702 27.3 800 bga 388 26358 437 437 paetc amd THERMAL test die 314 322 101108 4909 14.5 4.7 0 10/98 2s2p 98049 5024 11.6 200 5070 10.6 400 5102 9.9 600 5129 9.5 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 57 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code bga 388 26358-i 437 437 paetc amd THERMAL test die 314 322 101108 4913 13.8 4.7 0 12/98 2s2p 99004 5026 11.8 200 5024 10.8 400 5045 10.1 600 5065 9.7 800 bga 388 ase-ibhf 302 366 paetc amd THERMAL test die 208 322 66976 4303 16.6 3.3 0 03/99 2s2p 99005 4399 14.7 200 4445 13.6 400 4472 12.9 600 4487 12.5 800 bga 388 ase-ibhf 302 366 paetc amd THERMAL test die 208 322 66976 4497 26.3 6.8 0 03/99 2s2p,so 98048 4554 24.7 200 4701 20.6 400 4823 17.7 600 4889 16.2 800 bga 416 x26281 583 583 paetc amd THERMAL test die 314 322 101108 5446 12.1 2.3 0 02/99 2s2p 99006 5591 10.4 200 5657 9.3 400 5693 8.8 600 5717 8.4 800 bga 416 x26408 543 543 paetc amd THERMAL test die 314 322 101108 7706 12.2 1.7 0 02/99 2s2p 97139 7913 10.6 200 8017 9.6 400 8092 9.0 600 8131 8.6 800 bgd 420 26679 500 500 paetc amd THERMAL test die 420 432 181440 3584 15.8 2.7 0 11/99 1s0p 99052 3708 11.7 200 3804 9.0 400 3826 8.1 600 3804 7.5 800 bgd 420 26679 500 500 paetc amd THERMAL test die 420 432 181440 3858 9.6 1.0 0 11/99 2s2p 99053 3953 7.5 200 3993 6.2 400 4016 5.7 600 4026 5.5 800 bgu 484 26981 483 500 paetc amd THERMAL test die 314 322 101108 5368 12.5 3.5 0 10/00 2s2p 20011 5473 10.8 200 5573 9.7 400 5571 9.0 600 5594 8.6 800 5624 4.0 0 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 58 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code bgu 484 26981 483 500 paetc amd THERMAL test die 420 432 181440 6074 10.7 2.1 0 10/00 2s2p 20012 6171 9.0 200 6224 8.0 400 6264 7.3 600 6283 6.9 800 7926 2.6 0 bgu 484 26981 483 500 paetc amd THERMAL test die 420 432 181440 5180 9.4 1.9 0 01/01 2s2p s29949 5253 7.6 200 5288 7.0 400 5323 6.4 600 5322 6.0 800 5253 1.5 0 bga 492 25911 372 372 paetc amd THERMAL test die 314 322 101108 1622 16.6 3.2 0 10/97 2s2p 97140 3821 16.2 3.5 0 6412 15.9 3.7 0 6554 14.1 200 6648 13.0 400 6735 12.0 600 6772 11.6 800 bga 492 25911 372 372 paetc amd THERMAL test die 208 212 44096 3695 20.2 6.5 0 03/98 2s2p 99001 3764 17.7 200 3808 16.4 400 3833 15.6 600 3851 15.3 800 bga 492 27072 503 503 paetc amd THERMAL test die 420 432 181440 6107 12.9 1.8 0 03/01 2s2p 21062 6213 10.6 200 6262 9.7 400 6299 8.9 600 6318 8.6 800 bga 492 ase-ibfic 403 482 paetc amd THERMAL test die 314 432 135648 5942 14.8 3.4 0 03/99 2s2p 99002 6072 13.0 200 6132 11.9 400 6177 11.2 600 6210 10.8 800 bga 492 ase-ibfic 403 482 paetc amd THERMAL test die 314 432 135648 6008 12.4 3.4 0 03/99 2s2p 6191 10.6 200 6263 9.7 400 6290 8.9 600 6335 8.6 800 bga 569 26740 462 548 paetc amd THERMAL test die 420 432 181440 5435 13.6 2.3 0 04/00 2s2p 99059 5517 11.5 200 5563 10.5 400 5592 9.8 600 5610 9.4 800 msd advanced assembly technology advanced micro devices THERMAL characterization lab 9/5/01 THERMAL resistance analysis update page 59 pkg. ld. frm. x pad dim. y pad dim. int. die ext. die x die dim. y die dim. area p d q ja q jc q jma y j-t spd. test test type number (mils) (mils) number number (mils) (mils) (mil2) (mw) (c/w) (lfpm) date code lga 575 26650 paetc amd THERMAL test die 542 526 285092 4329 17.5 1.4 0 03/00 1s0p 20004 4377 14.4 200 4420 11.5 400 4440 10.1 600 4454 9.0 800 lga 575 26650 paetc amd THERMAL test die 542 526 285092 4846 12.9 1.0 0 03/00 2s2p 20006 4855 10.6 200 4884 9.1 400 4895 8.4 600 4908 7.6 800 key: so = socketed sm = surface mounted (soldered) hs = attached heat sink ?? = information not provided by requestor m = most (cmos therm. imp. analysis system) 1s0p = (one signal, zero plane) pcb 2s1p = (two signal, one plane) pcb 2s2p = (two signal, two plane) pcb ** = vcc & gnd wired directly to dut leads * = non trimmed & formed + = vertical position in wind tunnel msd advanced assembly technology advanced micro devices THERMAL characterization lab |
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